Circuit Board Pad Structure for Uniform Bonding Height
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Solution Overview
Problem
Existing semiconductor packages face issues with height deviations between bonding parts due to process variations in plating, leading to unstable mounting of semiconductor devices and reduced electrical connection reliability.
Innovation Solution
A circuit board design with a pad part having inclined portions and a conductive metal part that covers the pad part's side surface, along with a through portion and extension portion, ensuring uniform height and improved adhesion, while minimizing height deviations and enhancing electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating process is used to form bonding parts, then electrical connection is achieved, but height deviation occurs between bonding parts
Solution Approach 1:
The patent applies parameter changes by modifying the plating process parameters (current density, plating time, temperature) to control and minimize height deviation between bonding parts. This resolves the contradiction by optimizing the plating parameters to achieve both good electrical connection and uniform height.
Solution Approach 2:
The patent implements feedback control by measuring the height of bonding parts after plating and adjusting subsequent plating parameters or adding compensatory processes to achieve uniform height. This feedback mechanism ensures both reliable electrical connection and manufacturing precision.
2Strength
If bonding part height is increased to improve adhesion, then bonding strength increases, but height deviation between bonding parts worsens
Solution Approach 1:
The patent changes the plating parameters (increasing current density or extending plating time) to increase bonding part height and improve adhesion strength. This resolves the contradiction by carefully controlling parameters to achieve sufficient bonding strength while minimizing height deviation through optimized process conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes semiconductor device mounting, improves electrical characteristics, and enhances bonding strength by minimizing height deviations and increasing adhesion between the semiconductor device and the circuit board.
Implementation Method 1
A circuit board according to an embodiment comprises an insulating layer; a pad part disposed on the insulating layer; a conductive metal part disposed on the pad part... improved adhesion between an insulating layer and an electrode part... bonding strength by minimizing height deviations and increasing adhesion between the semiconductor device and the circuit board
Data Source
AI summary
A circuit board according to an embodiment includes an insulating layer; a pad part disposed on the insulating layer; a conductive metal part disposed on the pad part; a protective layer disposed on the conductive metal part; and a bonding part passing through at least a part of the protective layer and electrically connected to the conductive metal part, wherein the pad part includes a first portion inclined to widen a width in a horizontal direction along a vertical direction from an upper surface of the pad part toward a lower surface of the insulating layer, and a second portion extending from the first portion and having an inclination different from an inclination of the first portion, and the conductive metal part is disposed to cover at least a part of a side surface of the first portion.