Circuit Board Capacitive Coupling for Crosstalk Suppression
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Solution Overview
Problem
As frequency increases, crosstalk interference becomes more severe, requiring larger coupled capacitance, which increases the area of capacitors on circuit boards, leading to higher production errors and costs.
Innovation Solution
The use of circular capacitors and via capacitors on a circuit board, where the capacitive structure is coupled with signal wires and capacitive cylinders, allowing for efficient capacitance distribution and reduced process deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If larger coupled capacitance is used to suppress crosstalk signal interference, then crosstalk suppression performance is improved, but capacitor area increases leading to higher process error
Solution Approach 1:
The via capacitor structure embeds a conductive via hole within the capacitor electrode pattern, creating a nested configuration where the via hole acts as an internal electrode. This nesting approach increases the effective capacitance density without proportionally increasing the overall footprint area, thereby improving crosstalk suppression while controlling manufacturing precision requirements
Solution Approach 2:
The invention transitions from planar capacitor structures to three-dimensional configurations by utilizing via holes that extend vertically through the substrate. This dimensional change allows capacitance to be accumulated in the vertical dimension rather than only in the planar dimension, achieving higher coupled capacitance with reduced planar area and consequently reduced process error impact
2Reliability
If larger capacitor area is used to increase coupled capacitance, then crosstalk suppression is improved, but production cost increases
Solution Approach 1:
By nesting the via capacitor structure within existing capacitor regions, the design utilizes shared substrate area and existing manufacturing features. This nesting approach achieves higher effective capacitance without requiring proportional increases in production area, thereby reducing the impact on production cost
Solution Approach 2:
The via structure serves multiple functions: it acts as an electrode for the capacitor, provides grounding reference, and utilizes the substrate thickness dimension for capacitance accumulation. This multi-functionality reduces the need for separate dedicated structures, simplifying manufacturing and reducing overall production cost while maintaining improved crosstalk suppression
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances area usage efficiency and reduces capacitive deviations during manufacturing, achieving similar crosstalk performance with significantly smaller capacitor areas compared to traditional designs.
Implementation Method 1
the capacitive structure and the capacitive cylinder are capacitive coupled between the first signal wire and the second signal wire
Data Source
AI summary
A circuit board for a communication connector, comprising a first signal input terminal, a first signal output terminal, a second signal input terminal, a second signal output terminal, a first signal wire, a second signal wire, a capacitive structure and a capacitive cylinder. The first signal input terminal and the first signal output terminal are coupled by the first signal wire; the second signal input terminal and the second signal output terminal are coupled by the second signal wire; the capacitive structure is coupled with the first signal wire; the capacitive cylinder is coupled with second signal wire. The capacitive structure and the capacitive cylinder are capacitive coupled between the first signal wire and the second signal wire.