Circuit Board Dimple Standoff for Reliable Solder Joints
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Solution Overview
Problem
Existing methods for mounting circuit packages to circuit boards face challenges in achieving reliable solder joints and minimizing voids, particularly with traditional screen-printing technologies that produce solder joints of limited height.
Innovation Solution
The introduction of dimples on the circuit board surface with a depression surrounded by a raised perimeter, which provides a mechanical standoff during the solder reflow process, enhancing solder joint reliability and reducing voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional screen-printing solder technology is used, then the manufacturing process is simple, but the solder joint height is limited to 1.0-1.5 mils resulting in unreliable solder joints
Solution Approach 1:
The dimple structure is pre-formed on the circuit board before the soldering process. This preliminary action creates a predetermined depression that will later accommodate the solder joint, allowing the solder to fill the dimple and form a taller, more reliable joint without requiring complex real-time adjustments during soldering.
Solution Approach 2:
The invention changes the geometric parameter of the circuit board surface by introducing a dimple with specific depth and diameter dimensions. This parameter change allows the solder joint height to increase from the traditional 1.0-1.5 mils to potentially 2.0-3.0 mils or more, directly improving solder joint reliability while maintaining compatibility with existing soldering processes.
2Reliability
If solder joint height is increased to 2.0-3.0 mils, then solder joint reliability improves and flux residue can escape, but the circuit board structure becomes more complex
Solution Approach 1:
The dimple geometry is pre-determined and pre-formed on the circuit board before soldering. This allows precise control of the dimple dimensions (depth, diameter, shape) to be established in advance, ensuring that the solder joint achieves the desired height of 2.0-3.0 mils while providing adequate space for flux residue escape, without requiring complex real-time adjustments during the soldering process.
3Reliability
If a dimple structure is added to the circuit board, then solder joint height increases and flux residue can escape, but the manufacturing process becomes more complex
Solution Approach 1:
The dimple structure is incorporated into the circuit board manufacturing process as a preliminary step before final assembly. By pre-forming the dimple during board fabrication rather than adding it later, the invention integrates the complexity into an existing process step, avoiding the need for additional post-processing operations and maintaining manufacturing efficiency.
Solution Approach 2:
The invention merges the dimple formation process with the existing circuit board manufacturing process. Instead of treating dimple creation as a separate, additional step, it combines this function with board fabrication operations, thereby reducing overall manufacturing complexity while still achieving the benefit of increased solder joint height and improved flux residue escape.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dimples improve solder joint reliability and reduce voids by maintaining mechanical strength and allowing flux residue to escape, resulting in more robust electrical connections.
Implementation Method 1
a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board
Implementation Method 2
a dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board
Data Source
AI summary
An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board.