Wiring Circuit Board Edge Structure for Isolation and Bend Control
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Solution Overview
Problem
Conventional wiring circuit boards face issues with incomplete lead wire cutting, leading to short circuits between the conductive layer and metal support substrate, and bending of the insulating layer edge due to excessive removal of the substrate extension portion.
Innovation Solution
The wiring circuit board design includes a configuration with a main structure portion where the metal support substrate extends outwardly and a partial structure portion where the insulating layer extends outwardly, ensuring electrical separation and reducing bending by partially removing the lead wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate extension portion is removed by etching along the entire edge portion to ensure electrical separation, then short circuits are prevented, but the insulating layer edge becomes likely to bend causing peeling and shape failure
Solution Approach 1:
The edge portion is divided into two distinct regions: a first edge portion where the substrate extension portion is removed to ensure electrical separation, and a second edge portion where the insulating layer extension portion is retained to prevent bending and peeling. This segmentation allows each region to fulfill its specific function without compromising the other.
Solution Approach 2:
Different treatments are applied to different regions of the edge portion. The first edge portion undergoes substrate removal for electrical isolation, while the second edge portion maintains the insulating layer extension for mechanical stability. This local differentiation resolves the contradiction by allowing electrical separation where needed while preserving structural integrity where required.
2Reliability
If the lead wire is completely removed to prevent short circuits, then electrical isolation is achieved, but manufacturing complexity increases due to additional etching steps
Solution Approach 1:
The insulating layer extension portion is formed in advance during the manufacturing process, creating a pre-prepared structure that simplifies subsequent lead wire removal operations. This preliminary action reduces the complexity of the overall manufacturing process while ensuring reliable electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents short circuits and minimizes bending of the insulating layer edge, maintaining structural integrity and preventing peeling, while ensuring electrical separation of the conductive layer from the metal support substrate.
Implementation Method 1
a coated film such as tin coated film and nickel coated film is formed on the surfaces of the wiring pattern and the ground pattern by the electroless plating process on the surfaces
Data Source
AI summary
A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.