Circuit Board Structure with Integrated Fluid Channels for Heat Dissipation
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Solution Overview
Problem
Existing circuit board structures with micro-fluidic channels or heat pipes often fail to achieve optimal heat dissipation due to inadequate structural connections between the heat source and the heat transfer medium, leading to reduced efficiency.
Innovation Solution
A circuit board structure featuring a patterned circuit layer with integrated fluid channels, where a heat absorption section is adjacent to the heat source, allowing for direct heat transfer to a heat dissipation section, enhancing heat dissipation without the need for additional heat transfer mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a micro-fluidic channel or heat pipe is embedded in a dielectric substrate to solve heat dissipation, then heat transfer capability is improved, but structural complexity and additional heat transfer mechanisms are required
Solution Approach 1:
The patent combines the circuit board structure with the heat dissipation structure into a single integrated unit. The circuit board serves dual functions as both the electrical connection medium and the heat transfer medium, eliminating the need for separate heat pipes or micro-fluidic channels embedded in the substrate. This integration resolves the technical contradiction by maintaining effective heat dissipation while significantly reducing structural complexity.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: it provides electrical connections for power delivery and signal transmission, while also serving as the primary heat dissipation pathway. By making the circuit board itself the heat transfer medium, the invention eliminates the need for dedicated heat transfer components, thereby reducing device complexity while maintaining effective thermal management.
2Temperature
If additional heat transfer mechanisms are used to connect the heat source to the micro-fluidic channel, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat transfer function directly into the circuit board structure. The circuit board itself acts as the heat transfer medium, conducting heat away from the heat source through its inherent thermal conductivity. This eliminates the need for additional heat transfer mechanisms such as thermal interface materials, heat pipes, or separate fluid channels, thereby maintaining heat transfer efficiency while reducing overall device complexity.
Solution Approach 2:
The circuit board performs heat dissipation as an inherent function of its own structure, without requiring external or additional heat transfer components. The circuit board's material composition and structural design enable it to self-conduct heat away from the heat source, making the system simpler while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat transfer from the heat source to the outside, improving the overall heat dissipation effect by positioning the fluid channel close to the heat source and utilizing a high-conductivity patterned circuit layer, thus eliminating the need for special conducting mechanisms.
Implementation Method 1
The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel
Implementation Method 2
the heat dissipation fluid circulates between the heat absorption section and the heat dissipation section
Data Source
AI summary
A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.