Multi-Layer Circuit Board With Ground Shielding For Signal Integrity

The patent transitions from a conventional planar single-layer layout to a three-dimensional multi-layered structure. Signal lines are arranged across multiple layers (first signal line layer, second signal line layer, third signal line layer) with vertical stacking, enabling efficient use of spatial resources. This dimensional transformation allows sufficient line routing capacity within a reduced footprint, resolving the contradiction between compact board size and adequate line space.

The patent implements nested arrangement of signal lines where the first signal line is positioned between the second and third signal lines in the vertical direction. This nesting configuration allows multiple signal paths to occupy overlapping horizontal projections, maximizing space utilization. The ground lines are similarly nested between signal lines, creating a compact integrated structure that provides both routing capacity and electromagnetic shielding within minimal space.

The patent introduces ground lines as intermediary elements positioned between adjacent signal lines (first ground line between second and third signal lines, second ground line between first and third signal lines). These ground lines act as electromagnetic shields that intercept and redirect electromagnetic fields, preventing direct coupling between signal lines. This intermediary structure maintains signal integrity while enabling compact narrow-space routing.

The patent applies differential quality treatment to different spatial regions. Ground lines are strategically positioned in high-electromagnetic-interference zones between signal lines, while signal lines themselves are optimized for routing. This localized quality assignment—providing shielding only where electromagnetic coupling occurs—effectively prevents coupling failure without requiring uniform spacing throughout the entire circuit board, thus maintaining compact size.