Cross-Talk/Noise/Interference Reduction TRIZ Cases
- EBG Shielded Antenna Device for mmWave Signal Integrity
An electromagnetic bandgap structure on a conductive shield reduces signal loss and improves transmission power across the 20 to 30 GHz mmWave band.
- Embedded Multilayer Capacitor via Vertical Vias
Vertical vias connect internal electrodes to top and bottom terminals, preventing chipping and cracking during board warping.
- RF Circuit Font Routing Replaces Resistor for Impedance Matching
Replacing resistors with font routing eliminates retesting costs while maintaining impedance matching for high frequency operations.
- PCB Contact Finger Plating to Reduce Galvanic Etching
Common plating on the contact finger and via pad prevents galvanic etching of internal traces, maintaining impedance accuracy.
- High-Frequency Module Resonance Suppression via Resistive Element
Resistive element between circuit board and chassis absorbs electromagnetic waves to suppress intra-modular resonance.
- Surface-Mount Component Electromagnetic Shielding for IC Links
A surface-mount component with metal layers limits electromagnetic disturbance between integrated circuit links.
- Z-Directed PCB Capacitors for High Density Integration
Inserting modular Z-directed capacitors into PCB cavities increases component density without adding manufacturing complexity.
- Conductive Dome Probes for High Speed PCB Signal Testing
Conductive dome probes interface with high density interconnect microvias to enable in-circuit testing of printed circuit board signals.
- Optical Modulator Recess Design for Resonance Suppression
A recess portion on the housing mounts a flexible printed circuit to prevent resonance modes.
- PCB Connector With Integrated Magnetic Collar for EMI Suppression
A connector assembly integrates a magnetic collar to suppress electromagnetic interference on printed circuit boards.
- Resistive PCB Traces for Impedance Stability
Configurable conductive traces provide equivalent series resistance to dampen resonance, eliminating resistor shortages and reducing impedance peaks.
- PCB Connection Module With Reference Layer Through-Holes
Spaced reference layers with through-holes allow overlapping optical and electrical interface positions while reducing electromagnetic interference radiation.
- Communication Device Antenna Substrate Segmentation
Segmented substrate isolates antenna from metal components, reducing interference and device size.
- Printed Wiring Board With Differential Copper Foil Thickness
A printed wiring board design uses thicker copper foil in first conductive layers to enhance rigidity and connection reliability.
- Multi-Layer IC Signal Routing with Offset Reference Traces
Offset reference traces in adjacent metal layers minimize noise levels while maintaining compact device size.
- Perpendicular Differential Signal Pair Orientation for Crosstalk Reduction
Orienting adjacent differential signal pairs perpendicularly reduces capacitive and inductive coupling between the lines.
- EMI Shielding Film With Undulating Surface And Convex Particles
Undulating shielding layer with convex particles increases adhesive receiving amount, preventing high-temperature delamination in flexible circuit boards.
- Segmented Interposer Design for Circuit Board Bending and Material Utilization
Segmented interposers with protruding dummies reduce bending and cracking while improving material utilization efficiency.
- Multilayer PCB Wiring Reduces DDR3 Signal Ringing
Alternating inner layer wiring patterns in a multilayer printed circuit board reduces branch wire lengths to minimize signal turbulence.
- Display Device Signal Delay Equalization via PCB Wiring
A display device uses specific circuit board wiring configurations to equalize signal delay variations across the fan-out area.
- Insulating Member Arrangement for FPCB Noise Coupling Reduction
An insulating member contacts a conductive sheet on a flexible printed circuit board to block signal noise generation.
- Anti-pad Ground Plane Configuration for Power Via Resonance
Ground plane anti-pad isolates signal and power vias to reduce insertion loss and return loss in high-speed PCBs.