Segmented Interposer Design for Circuit Board Bending and Material Utilization
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Solution Overview
Problem
The existing closed loop-shaped interposers in electronic devices are prone to bending, cracking, and reduced material utilization, leading to increased manufacturing costs and partial disconnection of side plating, which affects electrical connections and EMI/EMC performance.
Innovation Solution
Implementing a plurality of discontinuous and separated interposers with protruding dummies on opposite ends to reduce bending and enhance material utilization, while maintaining effective shielding and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a closed loop-shaped interposer is used, then the interposer can surround components and provide structural support, but it is vulnerable to bending, warpage, and cracks
Solution Approach 1:
The interposer is divided into multiple separate interposer portions (e.g., first interposer portion, second interposer portion) instead of using a single closed loop structure. Each portion can be independently manufactured and assembled, reducing internal stress and susceptibility to bending and cracking while maintaining the surrounding functionality.
2Object-affected harmful factors
If a large-sized closed loop interposer is manufactured, then it can provide comprehensive shielding, but the number of interposers produced from raw material is reduced and material costs increase
Solution Approach 1:
The interposer structure is segmented into multiple smaller portions that can be arranged in different configurations. This segmentation allows more interposers to be cut from a single raw material sheet, improving material utilization efficiency while each portion maintains the necessary shielding characteristics.
Solution Approach 2:
Multiple separate interposer portions are combined to work together as a unified shielding structure. The portions are positioned to collectively surround the components, achieving comprehensive EMI shielding equivalent to or better than a single large closed loop, while using material more efficiently.
3Ease of operation
If protruding dummies are formed on a closed loop interposer for transport and plating, then handling is enabled, but side plating is partially cut off and shielding is compromised
Solution Approach 1:
The interposer is segmented into multiple portions with protruding dummies formed on each portion. This allows dummies to be positioned on separate segments rather than requiring them to protrude from the closed loop structure, enabling complete side plating on each segment without compromising shielding continuity.
Data Source
AI summary
According to various embodiments of the disclosure, an electronic device may comprise: a display, a first circuit board disposed under the display, at least one component disposed on one surface of the first circuit board, an interposer surrounding at least two sides of the at least one component and disposed on the first circuit board, and a second circuit board spaced apart from the first circuit board and including an area joined with the interposer. The interposer may include: a first interposer portion disposed along a first area of the first circuit board, a first end of the first interposer having at least a portion including a non-shielding area, and a second interposer portion disposed along a second area, adjacent to the first area, of the first circuit board, a second end of the second interposer facing the first end and having at least a portion including a non-shielding area.