EMI Shielding Film With Undulating Surface And Convex Particles
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electromagnetic interference (EMI) shielding films for flexible circuit boards suffer from insufficient adhesive receiving amount, leading to high-temperature delamination and inadequate puncture force, which affects the shielding effectiveness and reliability of the circuit boards.
Innovation Solution
The EMI shielding film features a first shielding layer with an undulating surface, convex particles on its second surface, and a second shielding layer that forms protrusions and recesses on its outer surface, enhancing the adhesive film's puncture strength and coverage, thereby ensuring effective grounding and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a flat shielding layer with conductive adhesive layer is used, then the shielding structure is simple, but the adhesive receiving amount is insufficient causing high-temperature delamination
Solution Approach 1:
The patent applies surface curvature by creating undulating surfaces on the shielding layer with convex and concave features. This transforms the flat surface into a three-dimensional profile that increases surface area and provides mechanical interlocking with the adhesive layer, thereby improving adhesive bonding reliability without significantly complicating the overall shielding structure
Solution Approach 2:
The patent introduces a microporous layer between the shielding layer and adhesive layer, creating a porous structure that increases adhesive receiving amount. The porous material allows adhesive to penetrate and anchor mechanically, enhancing bonding reliability while maintaining a relatively simple shielding structure composition
2Weight of moving object
If the adhesive film layer is made thin to reduce weight, then the weight decreases, but the puncture force becomes insufficient
Solution Approach 1:
By creating convex and concave undulations on the shielding layer surface, the patent concentrates stress at the convex peaks during puncture operations. This geometric concentration effect allows thin adhesive layers to achieve sufficient puncture force through localized stress amplification rather than requiring increased material thickness or weight
Solution Approach 2:
The patent employs composite material structures combining shielding layer, microporous layer, and adhesive layer with specific material properties. The composite structure achieves adequate puncture force in thin configurations by optimizing the interaction between different material layers, balancing weight reduction with mechanical performance
3Stability of the object's composition
If the shielding layer does not directly contact the ground layer, then the adhesive layer provides uniform bonding, but the EMI shielding effectiveness is reduced
Solution Approach 1:
The convex and concave undulations on the shielding layer create localized contact points with the ground layer through the adhesive. These geometric features ensure direct electrical contact pathways for EMI shielding while the concave regions maintain adhesive distribution for uniform bonding, resolving the contradiction between contact effectiveness and bonding uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the adhesive receiving amount and puncture strength, preventing delamination and ensuring reliable EMI shielding, even under high-temperature conditions, by allowing the shielding layer to directly contact the circuit board's ground layer and efficiently guide interference charges.
Implementation Method 1
the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion at a position corresponding to the convex particles on an outer surface of the second shielding layer and forming a recessed portion at other positions
Implementation Method 2
The conductive adhesive layer is connected to a ground layer of the circuit board by means of the shielding layer, thus guiding an interference charge to the ground layer of the circuit board and implementing the shielding
Data Source
AI summary
Disclosed are an electromagnetic interference shielding film, a circuit board and a preparation method for the electromagnetic Interference shielding film. The electromagnetic interference shielding film includes a first shielding layer, a second shielding layer, an adhesive film layer and multiple convex particles, wherein a second surface of the first shielding layer is an undulating uneven surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion on an outer surface of the second shielding layer and forming a recessed portion at other positions; the undulation degree of the outer surface of the second shielding layer is greater than that of the second surface; and the adhesive film layer is disposed on the outer surface of the second shielding layer.