High-Frequency Module Resonance Suppression via Resistive Element
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Solution Overview
Problem
High-frequency circuits experience intra-modular resonance and characteristic degradation due to electromagnetic waves propagating between the high-frequency circuit board and the metallic chassis, especially at frequencies exceeding 30 GHz, leading to unstable operations and impaired performance.
Innovation Solution
A high-frequency module is designed with a resistive element placed between the high-frequency circuit board and the inner wall of the chassis, acting as an electromagnetic wave absorber to suppress intra-modular resonance by attenuating the TE10 mode, which includes a coplanar transmission line with specific dimensions and a resistive element that absorbs electromagnetic waves, thereby reducing propagation loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electromagnetic waves propagate through the gap between high-frequency circuit board and chassis inner wall, then spatial propagation mode is established, but intra-modular resonance occurs and characteristic degradation happens
Solution Approach 1:
A resistive element is introduced as an intermediary component between the high-frequency circuit board and the chassis inner wall. This resistive element absorbs electromagnetic waves and converts them to heat energy, preventing the waves from establishing spatial propagation modes that would cause intra-modular resonance. The mediator effectively decouples the harmful interaction between the circuit board and chassis while maintaining electrical connection functionality.
Solution Approach 2:
The resistive element converts harmful electromagnetic wave energy into beneficial heat energy through resistive dissipation. By transforming the electromagnetic waves that would otherwise cause resonance into thermal energy, the harmful factor is converted into a harmless (or even useful for thermal management) form, thereby suppressing intra-modular resonance and improving circuit stability.
2Reliability
If through-substrate via is used to suppress substrate resonance, then electromagnetic wave leakage to substrate is prevented, but device complexity increases due to dense via formation
Solution Approach 1:
The invention extracts the resonance suppression function from the substrate structure itself (which would require complex through-substrate via formation) and relocates it to a separate resistive element positioned in the gap between the circuit board and chassis. This separation allows the substrate to maintain its original simple structure while the resistive element provides the necessary electromagnetic wave absorption independently.
Solution Approach 2:
The resonance suppression function is segmented from the substrate and implemented as a distinct component (resistive element). Instead of making the entire substrate complex with dense vias, the suppression function is isolated to a specific element that can be independently designed, manufactured, and positioned, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resistive element effectively suppresses intra-modular resonance and associated characteristic degradation, ensuring stable operations by imparting sufficient propagation loss to the TE10 mode and maintaining low propagation loss in the high-frequency circuit, thus enhancing the performance of high-frequency circuits at high frequencies.
Implementation Method 1
a resistive element (30) provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board
Implementation Method 2
a resistive element (30) provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board
Data Source
AI summary
A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.