Circuit Board Grounding Layer Void Region Filtering
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Solution Overview
Problem
Existing circuit boards face challenges in maintaining high-frequency signal transmission quality while avoiding mutual interference without increasing their size, particularly in managing electromagnetic waves.
Innovation Solution
A circuit board design featuring a grounding layer with a void region containing three straight line parts, an insulating layer separating the grounding layer from signal lines, effectively isolates electromagnetic interference and reduces space requirements by incorporating a simple filtering mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional grounding structures are used, then electromagnetic interference shielding is provided, but signal transmission quality deteriorates due to mutual interference and the board size increases
Solution Approach 1:
The grounding layer is segmented by introducing void regions with specific geometric patterns (first, second, and third straight line parts) that divide the grounding structure into functional zones. This segmentation allows the grounding layer to provide electromagnetic shielding while creating controlled interaction zones with signal lines for filtering effects, thereby improving signal quality without requiring a larger board area.
Solution Approach 2:
The grounding layer incorporates void regions with a porous-like geometric structure consisting of interconnected straight line parts. This porous configuration reduces the effective area of the grounding layer, minimizing board space requirements, while still maintaining electromagnetic interference shielding capabilities and providing filtering effects on high-frequency signals.
2Reliability
If filtering structures are added to improve signal quality, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The filtering function is merged with the grounding layer structure itself. The void regions with specific geometric patterns (first, second, and third straight line parts) perform both grounding and filtering functions simultaneously. This integration eliminates the need for separate filtering components, thereby improving signal quality without increasing device complexity.
Solution Approach 2:
The grounding layer is designed to serve multiple functions: providing electromagnetic shielding, establishing reference potential, and filtering high-frequency signals. The void regions with specific geometric configurations enable the grounding layer to act as both a shielding structure and a filtering element, reducing the need for additional components and simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a good filtering effect with minimal space and cost, enhancing signal integrity and line density on the circuit board.
Implementation Method 1
The insulating layer is disposed between the grounding layer and the pair of signal lines and separates the grounding layer from the pair of signal lines
Implementation Method 2
The void region includes a first straight line part, a second straight line part and a third straight line part... Based on the above, in the circuit board of the disclosure, a good filtering effect can be achieved
Data Source
AI summary
A circuit including a grounding layer, a pair of signal lines and an insulating layer is provided. The grounding layer has a void region. The void region includes a first straight line part, a second straight line part and a third straight line part. The second straight line part and the third straight line part are connected to two ends of the first straight line part. An orthogonal projection of the pair of signal lines on the grounding layer crosses the first straight line part. The insulating layer is disposed between the grounding layer and the pair of signal lines and separates the grounding layer from the pair of signal lines.