High Frequency Circuit Adaptations TRIZ Cases
- PCB Band Elimination Filter Using Grounded Open Stubs
A printed circuit board integrates a main wiring pattern with two open-ended stubs to attenuate signal components at integral multiples of the fundamental frequency.
- PCB Signal Integrity Immunity to Temperature via Thermal Segmentation
A printed circuit board design uses trenches and moats to thermally isolate high-speed traces from heat sources.
- Combined Via Structure for Compact Multilayer Filters
A combined via structure integrates signal and ground vias with corrugated plates to control impedance in multilayer boards.
- Laminated PCB with Varying Material Openings for RF Integration
A laminated single board design using sequentially pressed high-frequency, prepreg, and low-frequency board materials with varying openings and via holes.
- Selectively Recessed Reference Plane for Memory Module Signal Integrity
A selectively recessed reference plane structure optimizes signal transmission speed in memory modules.
- Circuit Board Via Transition Structure for Crosstalk Reduction
Segmented ground return path vias reduce far-end crosstalk by eliminating overlapping return currents in high-density circuit board designs.
- Via Conductor Impedance Matching in Multilayer PCBs
Parallel via conductors connected by intermediate signal wiring patterns increase capacitance to reduce characteristic impedance variation.
- Double-Sided Network Fabrication via Conformal ALD Seed Layers
Conformal alumina coatings and high power impulse magnetron sputtering create continuous seed layers, resolving metal coverage issues in high-aspect-ratio vias.
- Flat Cable Impedance Stabilization via Asymmetric Ground Openings
Asymmetric ground conductor openings stabilize characteristic impedance in flat cables, reducing fluctuations when attached to metallic objects.
- Epoxy Resin Composition for High Frequency Circuit Boards
A cyanate ester and active ester cured epoxy resin composition with naphthol structures delivers excellent dielectric properties.
- Flexible High-Frequency Signal Line Impedance Stability
Asymmetric via-hole placement in meandering sections preserves flexibility while preventing characteristic impedance shifts caused by floating capacitance.
- Low Impedance Transmission Line Segments for Return Loss
Segmented transmission lines with vertically stacked paths improve return loss by creating targeted resonances across frequency bands.
- PCB Dielectric Voids for Signal Propagation Consistency
Air voids in dielectric material adjacent to conductive traces reduce signal propagation rate disparities.
- Multilayer PCB Differential Signal Synchronization via Anti-Pad Capacitance
Varying anti-pad radii equalizes electric lengths across differential signal lines, eliminating manual via shape adjustments and reducing design labor hours.
- Circuit Board Structure for Satellite Signal Feeding Module
Segmented grounding and feeding sheets on a dielectric substrate reduce insertion loss while enabling cost-effective integration with satellite antennas.
- RF Connection via Slot Aperture in Thick Ground Plate
A radio frequency connection arrangement couples signals through a parallel-sided slot aperture in a thick ground plate.