Circuit Board Structure for Satellite Signal Feeding Module
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional satellite signal processing systems face challenges in minimizing insertion loss while integrating low dielectric loss printed circuit boards with satellite antennas and back-stage signal-processing circuits, as these boards are expensive and not well-suited for integration.
Innovation Solution
A circuit board structure with a dielectric substrate, grounding sheets, top and bottom feeding sheets, and a conductive layer is designed, featuring a rib segment and extending segments with gaps, where the grounding sheets cover the rib and main segments, and the feeding sheets are electrically isolated from the grounding sheets, with the conductive layer providing electrical coupling through holes, allowing for reduced insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a printed circuit board with low dielectric loss (≤0.002) is used to minimize insertion loss, then insertion loss is reduced, but the cost increases significantly and integration with satellite antenna and back-stage signal-processing circuit becomes difficult
Solution Approach 1:
The patent changes the dielectric loss parameter from the conventional low value (≤0.002) to a higher range (0.003-0.01), which allows using standard, cost-effective printed circuit board materials while maintaining acceptable insertion loss performance when combined with the optimized microstrip line structure and grounding design
Solution Approach 2:
The circuit board is segmented into multiple functional layers with specific grounding patterns (continuous grounding on one side, partial grounding on the other side) and microstrip line configurations that are optimized for different signal processing needs, enabling better integration with satellite antenna and back-stage circuits while controlling insertion loss
2Loss of energy
If a printed circuit board with low dielectric loss (≤0.002) is used, then insertion loss is minimized, but the cost becomes prohibitive
Solution Approach 1:
The patent relaxes the dielectric loss requirement from ≤0.002 to 0.003-0.01, enabling the use of standard, cost-effective printed circuit board materials such as FR-4 while maintaining acceptable insertion loss performance through optimized microstrip line structure and grounding configuration
Solution Approach 2:
The patent employs standard, readily available printed circuit board materials with higher dielectric loss (0.003-0.01) instead of expensive specialized low-loss materials, making the solution economically viable for mass production and widespread deployment in satellite reception systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces insertion loss while being cost-effective and suitable for integration with satellite antennas and back-stage signal-processing circuits, utilizing a dielectric substrate with a dielectric loss greater than 0.01, enhancing the performance of satellite signal processing systems.
Implementation Method 1
a conductive layer, disposed in a plurality of first holes, disposed in the main segment and the rib segment, for electrically coupling the grounding sheets, and the conductive layer is further disposed in a plurality of second holes disposed in the extending segments, and configured for electrically coupling the top feeding sheets to the bottom feeding sheets
Data Source
AI summary
The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.