Laminated PCB with Varying Material Openings for RF Integration
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Solution Overview
Problem
Existing radio-frequency devices face challenges in miniaturization, cost-effectiveness, reliability, and assembly complexity due to the need for multiple boards, particularly in high-power applications where integrating high-power PA, LNA, power supply, and TRX modules on a single board is difficult due to signal loss, heat dissipation, and manufacturing costs.
Innovation Solution
A laminated single board design using sequentially pressed high-frequency, prepreg, and low-frequency board materials with varying openings and via holes, allowing for efficient heat dissipation and assembly, reducing manufacturing costs and complexity by eliminating the need for high-density interconnection technology and buried holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple single boards are used for radio-frequency modules, then design flexibility and heat dissipation are improved, but assembly complexity and reliability risks increase due to connectors and cable connections
Solution Approach 1:
The patent merges multiple single boards (PA board, TRX board, LNA board, power supply board) into a single integrated PCB. The PCB includes a first board material with a power amplification module, a second board material with a transceiver module and low noise amplifier module, and a third board material with a power supply module, all integrated onto one board to eliminate connectors and cable connections while maintaining heat dissipation capabilities through strategic material selection and layer design
2Ease of manufacture
If low-cost board material is used, then manufacturing cost is reduced, but signal loss increases making it unsuitable for high-frequency high-power applications
Solution Approach 1:
The patent applies local quality by using different board materials for different functional regions. The first board material (radio-frequency board material) is used specifically for the power amplification module where low signal loss is critical for high-frequency high-power applications. The second and third board materials (ordinary board material) are used for the transceiver module, low noise amplifier module, and power supply module where cost-effectiveness is more important and signal loss is less critical. This selective material assignment optimizes both performance and cost
3Loss of energy
If radio-frequency board material is used for the entire PCB, then signal loss is reduced, but manufacturing cost increases significantly
Solution Approach 1:
The patent implements local quality by assigning radio-frequency board material (first board material) only to the region containing the power amplification module where low signal loss is essential for high-frequency high-power operation. Ordinary board material (second and third board materials) is used for other regions (transceiver module, low noise amplifier module, power supply module) where cost reduction is prioritized. This selective approach reduces overall manufacturing cost while maintaining signal integrity where required
Solution Approach 2:
The patent segments the PCB into distinct functional regions with different material properties. The PCB is divided into a first board material region for power amplification, a second board material region for transceiver and low noise amplifier functions, and a third board material region for power supply. This segmentation allows each region to be optimized independently for its specific functional requirements, balancing performance and cost
4Adaptability or versatility
If HDI technology is used for single board sharing design, then integration density is improved, but manufacturing cost increases and radio-frequency board material cannot be pressed
Solution Approach 1:
The patent segments the PCB into multiple board material layers (first board material, second board material, third board material) that can be sequentially pressed together. This segmentation approach avoids the need for HDI technology by using through-holes that extend through all board materials, allowing radio-frequency board material to be pressed without requiring laser drilling. The segmentation enables integration of multiple modules on a single board while maintaining compatibility with conventional pressing processes and radio-frequency material properties
Data Source
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AI summary
A printed circuit board (PCB) is provided. The PCB includes a first microwave board material (1), a second prepreg (2), and a third ordinary board material (3) that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole (70) is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.