Circuit Board Heat Dissipating Structure
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Solution Overview
Problem
High-power electronic components on circuit boards generate significant heat, leading to reliability issues due to inadequate heat dissipation in existing multi-layer circuit board structures.
Innovation Solution
A circuit board structure with a heat dissipating structure comprising a first and second metal block joined through an interface, filled with interface material in a through hole, allowing efficient heat transfer and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high-power electronic components are disposed in the circuit board, then the function and performance of the circuit board are improved, but heat generation increases causing reliability problems
Solution Approach 1:
A heat dissipation structure is introduced as an intermediary component between the high-power electronic components and the circuit board substrate. This structure includes a first metal block in thermal contact with the component and a second metal block extending through a through-hole to the other surface, effectively mediating heat transfer away from the component and preventing thermal-induced reliability issues.
2Temperature
If conventional heat dissipation structures are used, then heat dissipation capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The heat dissipation structure is segmented into a first metal block and a second metal block connected through a through-hole. This segmentation allows each block to be independently formed and then joined, simplifying the manufacturing process compared to forming a single complex heat dissipation structure, while still achieving effective heat transfer through the circuit board.
3Loss of energy
If metal blocks are joined in the through hole, then heat dissipation efficiency is improved, but interface quality becomes critical
Solution Approach 1:
The interface between the first and second metal blocks is designed with a complementary shape where one block has a convex surface and the other has a concave surface. This geometric parameter change ensures that when the blocks are joined, their surfaces are flush and form a planar interface, eliminating gaps and ensuring high-quality thermal contact without requiring complex precision machining.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively transfers heat across the circuit board, improving heat dissipation capability, reducing manufacturing complexity and costs, and enhancing the quality and reliability of the circuit board.
Implementation Method 1
the heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined in the through hole and have an interface
Data Source
AI summary
A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.