Porous Dielectrics TRIZ Cases

Embedded thermally conductive foam directs coolant flow through a printed circuit board substrate to resolve localized hot spots and reduce thermal stress.

Segmented metallic sheets and vertical posts provide mechanical integrity while enabling access to lower surfaces and efficient layer stacking.

Photonic curing creates porous thin films with high sheet resistance. Compressive stress densifies the structure to reduce porosity and enhance conductivity.

Anodic oxidation creates a sealed alumina layer on aluminum substrates, resolving low thermal conductivity and weak adhesive force in circuit boards.

A circuit board heat dissipating structure uses joined metal blocks to transfer thermal energy across the substrate.

Gradient porosity oxide layer on metallic cores dissipates LED heat while maintaining electrical insulation to prevent overheating.

Controlling pore size distribution in thick polyimide articles resolves tensile strength and dielectric variation trade-offs.

An air-filled insulating layer in a co-axial via structure reduces dielectric constant and manufacturing costs while enhancing magnetic noise shielding.

Inorganic shell layers on hollow silica prevent pore collapse and glass penetration during pressure bonding, maintaining insulation reliability.

A multilayer substrate design uses a small-area first insulator layer overlapping a higher-porosity second insulator layer to prevent void crushing during hot-pressing.

A porous metal body filled with Sn-based solder alloy enables reliable internal semiconductor bonding.