Multilayer Substrate Insulator Layer Void Crushing Prevention
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Solution Overview
Problem
Existing high-frequency multilayer circuit boards face issues with voids in the thermoplastic resin foam film being crushed during hot-pressing, leading to dielectric loss and potential short circuits.
Innovation Solution
A multilayer substrate design featuring a second insulator layer with higher porosity and a specific stacking arrangement, where a small-area first insulator layer overlaps the second insulator layer, preventing void crushing and reducing dielectric loss by maintaining a low dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If thermoplastic resin foam film is used as insulator layer, then dielectric loss is reduced due to low dielectric constant, but voids in the foam film are easily crushed during hot-pressing
Solution Approach 1:
The patent changes the thickness parameter of the foam film insulator layer to be smaller than overlapping insulator layers, which prevents void crushing during hot-pressing while maintaining low dielectric loss. This parameter optimization resolves the contradiction between energy loss reduction and structural reliability.
2Reliability
If foam film insulator layer is made thinner to prevent void crushing, then void crushing is reduced, but maintaining low dielectric constant becomes more difficult
Solution Approach 1:
The patent applies local quality by making the foam film insulator layer thinner only in specific regions where it overlaps with other insulator layers, while maintaining adequate thickness in non-overlapping regions. This localized thickness optimization prevents void crushing in critical areas while preserving low dielectric constant properties overall.
3Ease of manufacture
If uniform thickness insulator layers are used, then manufacturing is simplified, but void crushing occurs in overlapping regions during hot-pressing
Solution Approach 1:
The patent implements local quality by specifying that the foam film insulator layer should have a smaller thickness in overlapping regions compared to non-overlapping regions. This non-uniform thickness distribution prevents void crushing during hot-pressing while remaining manufacturable through standard lamination processes.
Data Source
AI summary
A multilayer substrate includes a multilayer body including first insulator layers and a second insulator layer stacked on each other. The multilayer body includes first and second regions when viewed in a stacking direction. The first region is a region that does not include the second insulator layer when viewed in the stacking direction. The second region is a region that includes the second insulator layer when viewed in the stacking direction. The first insulator layers include a small-area first insulator layer located in the first region and not located in the second region. The small-area first insulator layer overlaps the second insulator layer when viewed in a first direction. A porosity of the second insulator layer is higher than an overall porosity of the first insulator layers.