Circuit Board Patterning by Imprint-Etching Without Lithography
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Solution Overview
Problem
Existing circuit board manufacturing processes, such as subtractive, full additive, and modified semi-additive processes, face inefficiencies due to the strain on lithographic equipment, leading to diminished manufacturing efficiency.
Innovation Solution
A method involving imprint-etching using a jig to form a concave and convex pattern on a conductive layer, followed by etching to create a circuit pattern, potentially eliminating the need for lithography and enhancing production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional lithographic processes are used for circuit board manufacturing, then circuit patterns can be formed, but manufacturing efficiency decreases due to equipment strain and increased complexity
Solution Approach 1:
The patent extracts and eliminates the lithographic process entirely from the circuit board manufacturing sequence. By using imprint-etching technology, the complex lithographic steps (photoresist coating, alignment, exposure, development) are removed and replaced with a direct mechanical/chemical imprinting process that forms patterns without requiring lithographic equipment.
Solution Approach 2:
The patent replaces the optical-mechanical lithographic system with a direct mechanical imprinting system. Instead of using light-based alignment and exposure mechanisms, the invention employs a mechanical imprint-etching process where a mold or stamp directly transfers the circuit pattern onto the substrate through mechanical pressure and chemical etching action.
2Productivity
If conventional subtractive or additive processes are used, then circuit boards can be manufactured, but production time increases and efficiency decreases
Solution Approach 1:
The patent merges multiple separate manufacturing steps into a single integrated imprint-etching process. Traditionally, separate steps include pattern transfer, etching, and processing; the invention combines these into one simultaneous operation where the imprint-etching process directly forms both the pattern and the etched features in a single manufacturing cycle.
Solution Approach 2:
The patent employs preliminary action by pre-preparing the imprint-etching mold or stamp with the desired circuit pattern before application. This pre-formed mold contains all the necessary pattern information and chemical etching features, allowing for rapid direct transfer to the substrate without requiring time-consuming on-site pattern generation or alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves manufacturing efficiency by reducing defects and costs while maintaining high process quality, allowing for precise circuit formation without the need for complex lithographic processes.
Implementation Method 1
using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern
Implementation Method 2
etching the intermediate to form a circuit board with a circuit pattern
Data Source
AI summary
Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.