Lithography/Patterning TRIZ Cases
- Stacked Circuit Structure for High-Density I/O Without Substrate Warpage
Vertical traces through openings raise I/O density without enlarging or thickening the substrate, helping maintain yield and limit warpage.
- Coaxial Via Circuit Board Layout for Impedance Matching and EMI Shielding
A grounded coaxial via layout removes insulating-layer mismatch to improve high-frequency signal integrity and EMI shielding.