Circuit Board With Segmented Dielectric Layers For Signal Integrity
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Solution Overview
Problem
Conventional circuit boards with coaxial vias experience impedance mismatch and electromagnetic interference due to insulating layers, affecting high-frequency signal integrity, and noise interference is not effectively reduced as signal and ground paths are on different planes.
Innovation Solution
A circuit board design featuring dielectric materials with different dielectric constants surrounding a conductive via structure, with the conductive via penetrating through multiple dielectric layers and being electrically connected to external circuit layers, forming a signal path surrounded by a ground path to enhance signal integrity and reduce noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If insulating layers are added between internal and external conductor layers for isolation, then electromagnetic interference is reduced, but impedance mismatch occurs and high-frequency signal integrity deteriorates
Solution Approach 1:
The patent changes the dielectric constant parameter by using different dielectric materials (first dielectric material with dielectric constant K1, second dielectric material with dielectric constant K2 where K1≠K2) in different regions surrounding the conductive via structure. This parameter variation allows optimization of impedance matching for high-frequency signals while maintaining electromagnetic isolation, resolving the contradiction between reducing EMI and preserving signal integrity.
2Adaptability or versatility
If signal path and ground path are located on different planes, then layout flexibility is improved, but noise interference cannot be effectively reduced
Solution Approach 1:
The patent applies local quality by creating a specific regional structure where the conductive via structure penetrates through multiple dielectric layers and is surrounded by conductive structures that form a localized ground path. This local ground shielding structure is positioned specifically around the signal transmission path, providing effective noise reduction at the critical location while allowing overall layout flexibility to be maintained.
3Speed
If conductive via structure penetrates through multiple dielectric layers with different dielectric constants, then signal transmission speed is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the dielectric structure into multiple distinct layers (first dielectric material layer, second dielectric material layer) with different dielectric constants, where each layer serves a specific function in the signal transmission path. The conductive via structure is divided into multiple segments that penetrate through these layers sequentially. This segmentation allows optimization of signal speed in each layer while organizing the manufacturing process into manageable stages, reducing overall manufacturing complexity.
Data Source
AI summary
A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.