Wiring Board Plating With Solid Electrolyte Membrane for Fine-Line Adhesion
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Solution Overview
Problem
Conventional methods for manufacturing wiring boards using the semi-additive method require multiple steps for forming and removing resin resist patterns, leading to increased waste and inadequate adhesion between plating layers, especially for fine wiring.
Innovation Solution
A method that forms a wiring board by depositing a metal layer on a substrate with a seed layer using a solid electrolyte membrane, eliminating the need for a resin resist pattern and enhancing adhesion by covering both the surface and side faces of the seed layer, thereby reducing the number of manufacturing steps and waste generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a semi-additive method is used to form a wiring layer, then high-density wiring capability is achieved, but multiple steps for resist pattern formation and removal are required, generating significant liquid waste
Solution Approach 1:
The invention extracts and eliminates the resist pattern formation and removal steps from the semi-additive method. By using a solid electrolyte membrane as a self-aligned mask during electroplating, the process directly forms the wiring pattern without requiring separate resist coating, patterning, and stripping steps, thereby eliminating the associated liquid waste.
Solution Approach 2:
The solid electrolyte membrane serves as an intermediary that enables direct pattern transfer from the seed layer to the metal layer. It acts as a self-aligned mask that allows copper ions to pass through only at the desired wiring locations during electroplating, eliminating the need for organic resist materials and their subsequent removal.
2Ease of manufacture
If a resin resist pattern is formed on the first plating layer, then the second plating layer can be formed, but the process requires multiple steps and generates waste
Solution Approach 1:
The solid electrolyte membrane performs multiple functions simultaneously: it acts as a mask, a source of metal ions, and a self-aligning element. The membrane automatically positions itself over the seed layer patterns, eliminating the need for separate resist application and alignment steps, thereby simplifying the manufacturing process.
Solution Approach 2:
The invention merges the mask function, metal ion source function, and alignment function into a single solid electrolyte membrane component. This consolidation eliminates the need for separate resist materials and multiple processing steps, reducing manufacturing complexity while maintaining ease of plating layer formation.
3Manufacturing precision
If the second plating layer is formed only on the surface of the first plating layer, then the wiring pattern is created, but adhesion between layers is insufficient for fine wiring
Solution Approach 1:
The invention transitions from two-dimensional surface-only plating to three-dimensional plating by having the solid electrolyte membrane conform to the seed layer topography. This enables metal deposition not only on the upper surface but also on the side walls of the seed layer structures, creating a cup-shaped metal layer that mechanically interlocks with the seed layer for enhanced adhesion.
Solution Approach 2:
The metal layer is formed to nest around the seed layer structure, coating both the outer surface and the side walls. This nested configuration creates a mechanically interlocked structure where the metal layer embraces the seed layer, significantly improving interlayer adhesion strength for fine wiring applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves favorable adhesion between the metal and seed layers without using a resin resist pattern, simplifying the manufacturing process and reducing waste, while maintaining high-density wiring capabilities.
Implementation Method 1
applying voltage between the anode and the underlayer to reduce metal ions contained in the solid electrolyte membrane and so form a metal layer on the surface of the seed layer
Implementation Method 2
The surface of the underlayer contains oxide, and such a surface of the underlayer therefore presumably has higher activation energy for the reduction reaction of the metal ions than the surface (laminated surface) and the side faces of the seed layer
Data Source
AI summary
Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.