Transparent PCB Low-Temperature Assembly Thermal Stress Management
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Solution Overview
Problem
Transparent circuit boards are prone to damage when electronic components are mounted using soldering due to high temperatures, which can harm both the components and the substrate.
Innovation Solution
A method for manufacturing transparent PCBs involves forming a hardened layer between the transparent base film and the oxide film to manage thermal stress, using a stacked structure of transparent conductive oxide layers and a metal layer, and applying conductive pastes that can be melted and cured at low temperatures to attach electronic components without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering is used to mount electronic components on transparent circuit substrate, then reliable electrical connection is achieved, but the transparent circuit substrate and electronic components are damaged by high temperature
Solution Approach 1:
The patent changes the temperature parameter from traditional soldering temperatures (typically 200-400°C) to low-temperature processing (below 150°C). This is achieved by using conductive paste instead of traditional solder, and employing UV irradiation or heat curing at low temperatures to activate the paste and form electrical connections, thereby avoiding thermal damage to the transparent substrate and temperature-sensitive components
Solution Approach 2:
The patent replaces the thermal field (soldering heat) with an optical field (UV irradiation) or low-temperature thermal field to activate the conductive paste. This substitution allows the formation of reliable electrical connections without subjecting the transparent substrate to high temperatures that would cause damage
2Object-affected harmful factors
If conductive paste is used instead of soldering, then thermal damage is avoided, but manufacturing process complexity increases
Solution Approach 1:
The patent introduces a transparent conductive oxide layer as an intermediary between the transparent substrate and the conductive paste. This intermediary layer provides a suitable surface for paste adhesion and ensures good electrical contact, simplifying the overall process by enabling direct paste application without requiring high-temperature soldering infrastructure
Solution Approach 2:
The patent applies the conductive paste in advance during the assembly process, followed by UV irradiation or low-temperature curing to activate it. This preliminary application of conductive material allows for subsequent simple curing steps rather than requiring complex high-temperature soldering equipment and processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the secure attachment of electronic components to transparent PCBs at low temperatures, preventing damage to temperature-sensitive components and substrates, while maintaining high light transmittance and suitable sheet resistance.
Implementation Method 1
forming a hardened layer between the transparent base film and the oxide film to manage thermal stress
Implementation Method 2
applying conductive pastes that can be melted and cured at low temperatures to attach electronic components
Data Source
AI summary
A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.