Embedded Circuit Board Insulation for SiC Heat Management
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Solution Overview
Problem
Silicon carbide power modules experience increased parasitic inductance due to wire bonding, affecting performance, and heat dissipation is reduced when components are embedded, leading to potential insulation layer damage from heat.
Innovation Solution
A circuit board with embedded elements featuring a conductive structure, electronic components, and a thermoplastic insulation layer with a heat deflection temperature between 376° C. and 410° C., along with a metal sintering layer and thermal conductive insulation, to enhance electrical connectivity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are embedded in circuit substrates to reduce parasitic inductance, then electrical performance is improved, but heat dissipation is reduced and insulation layers are prone to heat damage
Solution Approach 1:
The patent divides the insulation system into multiple layers: a first insulation layer surrounding the electronic component and a second insulation layer covering the first insulation layer. This segmented structure allows the first layer to provide immediate thermal protection to the component while the second layer provides additional thermal management and structural support, resolving the heat dissipation issue while maintaining electrical performance.
Solution Approach 2:
The patent employs composite material structures where the first insulation layer and second insulation layer are made of different materials with complementary properties. The first layer uses materials optimized for thermal isolation of the component, while the second layer uses materials with better heat dissipation characteristics, thus solving both the electrical performance and heat dissipation requirements simultaneously.
2Reliability
If electronic components are embedded in circuit substrates to reduce parasitic inductance, then electrical performance is improved, but the insulation layer is prone to be destroyed by heat
Solution Approach 1:
The patent applies beforehand cushioning by positioning the first insulation layer to surround the electronic component before the component is subjected to operational heat. This first layer acts as a pre-established thermal buffer that protects the component and surrounding structures from heat damage before it occurs, preventing insulation layer destruction while maintaining the embedded configuration for low parasitic inductance.
Solution Approach 2:
The first insulation layer serves as an intermediary between the electronic component and the external environment. It mediates the thermal interaction by providing thermal isolation to the component while allowing the second insulation layer to manage heat dissipation, thus protecting the insulation system from heat damage while preserving electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved insulation and heat dissipation, preventing damage to the insulation layer and enhancing the performance of the circuit board by maintaining structural integrity under heat stress.
Implementation Method 1
The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.
Implementation Method 2
a metal sintering layer disposed on the conductive structure and located between the conductive structure and the electronic component
Data Source
AI summary
A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.