Circuit Board Insulating Layer Planarization for Fine Feature Precision
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Solution Overview
Problem
The quality of circuit boards and light emitting modules is affected by the manufacturing method of the circuit boards, particularly due to issues with insulating layers and coating processes, which can result in unevenness and reduced accuracy in forming fine features and connections.
Innovation Solution
A manufacturing method for circuit boards involving a substrate with a first circuit layer, a first insulating layer, a second circuit layer, and a solder resist layer, where the insulating layers are formed and patterned to expose portions of the circuit layers, and a conductive layer is deposited to create electrical connections, followed by a solder resist layer to protect and expose specific areas for connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional coating processes are used to form insulating layers, then the manufacturing process is simple, but the surface flatness and precision are insufficient for fine features
Solution Approach 1:
A planarization layer is formed over the first insulating layer before subsequent processing steps. This preliminary planarization creates a flat surface that enables precise formation of fine features and improves alignment accuracy in later stages of the manufacturing process
2Reliability
If insulating layers are formed to protect circuit layers, then electrical insulation is achieved, but alignment accuracy for fine features deteriorates
Solution Approach 1:
The insulating structure is divided into multiple segments: a first insulating layer for electrical insulation and a separate planarization layer for surface flatness. This segmentation allows each layer to perform its specific function independently, maintaining both insulation reliability and alignment precision
3Manufacturing precision
If conventional manufacturing methods are used, then production efficiency is maintained, but product quality and fine feature formation are compromised
Solution Approach 1:
The planarization layer is formed by depositing material over the existing insulating layer, merging the insulation function with the planarization function in a single integrated structure. This combined approach improves fine feature formation quality without requiring separate complex processing steps, thereby maintaining manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the quality of circuit boards by ensuring a flat and precise surface for subsequent processes, enhancing alignment accuracy and allowing for finer features and connections, thereby improving the overall manufacturing process and product quality.
Implementation Method 1
forming a first conductive layer on the substrate, wherein the first conductive layer covers the first insulating layer having the insulating opening and the portion of the first circuit layer exposed by the insulating opening
Data Source
AI summary
A circuit board including a substrate, a first circuit layer, a first insulating layer, a second circuit layer, and a solder resist layer is provided. The first circuit layer is disposed on the substrate. The first insulating layer is disposed on the substrate and covers a portion of the first circuit layer. The second circuit layer is disposed on the first insulating layer and penetrates a portion of the first insulating layer to electrically connect the first circuit layer. The solder resist layer is disposed on the substrate and covers a portion of the second circuit layer.