Multi-Layer Circuit Board With Varying Insulating Layer Thicknesses
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Solution Overview
Problem
There is a need for a printed circuit board with a low dielectric constant that maintains rigidity to reduce transmission loss and ensure reliability for high-frequency signal transmission, while also minimizing the overall thickness and ensuring strength.
Innovation Solution
A circuit board design featuring multiple insulating layers with varying dielectric constants, strengths, and thicknesses, where at least one layer includes glass fiber for enhanced strength and others do not, allowing for reduced dielectric constant and thickness while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an insulator having a low dielectric constant is used, then transmission loss is reduced, but strength of the insulator decreases
Solution Approach 1:
The patent uses composite insulating layers combining glass fiber (providing strength) with low dielectric constant materials. Specifically, it employs a glass fiber reinforced plastic layer (first insulating layer) combined with a low dielectric constant insulating layer, creating a composite structure that achieves both mechanical strength and low transmission loss by leveraging the complementary properties of different materials.
2Loss of energy
If thickness of the insulator increases, then dielectric loss decreases, but overall thickness of the circuit board increases
Solution Approach 1:
The patent changes the dielectric constant parameter of the insulating materials to achieve lower dielectric loss without increasing thickness. By selecting materials with inherently low dielectric constants and optimizing the thickness of each insulating layer, the design reduces dielectric loss while maintaining a compact overall thickness through precise parameter control rather than simply increasing dimensional size.
3Loss of energy
If multiple insulating layers with different properties are used, then transmission loss is reduced, but device complexity increases
Solution Approach 1:
The patent segments the insulating structure into multiple functional layers, each with specific properties: a glass fiber reinforced plastic layer for mechanical strength, a low dielectric constant insulating layer for signal transmission, and a solder resist layer for surface protection. This segmentation allows each layer to perform its specialized function optimally, reducing overall transmission loss while maintaining manageable complexity through clear functional division.
Data Source
AI summary
A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.