Printed Circuit Aspects TRIZ Cases

Sandwiched between conductive and insulating layers, the thermally conductive insulating layer conducts heat away from signal paths through dedicated channels.

An offset substrate with a reflecting cup isolates P and N electrodes, preventing solder-induced short circuits while maintaining light output efficiency.

Varying terminal pin lengths align with blind holes terminating at specific conductor levels in multi-layer circuit boards.

Droplet application of raw material liquid forms a protective layer on an electrode substrate with varying film thickness across different regions.

Specific monomer ratios in the polyimide resin precursor reduce dielectric constant and water absorption while maintaining heat resistance.

Silver-plated filler particles in a binder system reduce sheet resistivity while preventing oxidation of the core material.

Chemical copper plating fills gaps between magnetic particles and resin in printed wiring boards, preventing peeling during thermal cycles.

A multilayer substrate integrates planar windings with a molded ferromagnetic core to create compact magnetic devices.

Composite seed layer with copper aluminum alloy and nickel prevents peeling under heat cycles while maintaining glass substrate flatness.

A wiring substrate uses graded inorganic filler content across resin insulating layers to balance thermal expansion and mechanical strength.

A composite circuit substrate structure embeds a patterned circuit in a first dielectric layer to isolate conductive elements from glass fiber reinforcement.

A mode switching circuit controls microcontroller voltage levels to reduce power consumption in ear thermometers.

Dual transverse dimensions in a single press-fit pin eliminate multiple pin lengths, reducing production costs while enabling varied plug-in functions.

A multichip LED package uses a metal substrate with mirror areas to dissipate heat and reflect light from series-connected chips.

A printed circuit coil integrates a metallic influencing element to form a unified sensor front end.

Segmented connector body creates recessed space zones to spare main board area for circuit layout, preventing gold finger oxidation and assembly misalignment.

Electrode pattern in flexible display bending regions enables vision inspection of residual adhesive contamination.

A microscope illumination unit uses a three-dimensional molded interconnect device to arrange optical components in free space.

A planar multi-layer assembly fabricates a dual frequency phased-array antenna using co-axially stacked shorted annular ring and circular patch elements.

Polyimide resin composition with pre-polymerized maleimide and specific diamines.

A wiring substrate plated film structure uses a co-precipitated nickel layer with bismuth and sulfur to prevent phosphorus-rich layers during reflow cycles.

A 1 to 100 angstrom oxide thin film on a wiring board maintains adhesive strength while enabling electrical conductivity, eliminating dry etching damage.

A flexible card uses dynamic magnetic communication and sensor detection to adapt to various reader types.

Merging electronic control and thermal safety mechanisms reduces device complexity while preventing overheating in household electrical appliances.

Multi-layer flexible circuit board structure with thinned body area reduces signal interference and enables narrow bezel designs.

A curable resin composition with controlled epoxy to active ester ratios achieves low dielectric loss tangent.

A printed circuit board uses alternating metal patterns and selective etching to form precise microcircuits without seed etching.