Polyimide Resin Composition for Low Dielectric PCB Laminates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin compositions for printed circuit boards face challenges with high dielectric constants, high dissipation factors, dryness, voids, and require high lamination temperatures, which affect signal transmission speed and integrity, especially in high-frequency applications.
Innovation Solution
A resin composition comprising a polyimide resin, pre-polymerised maleimide resin, thermosetting resin, and flame retardant, using specific diamines like 4,4′-diaminodiphenylmethane and polyetherdiamines, and acid anhydrides, which allows for low dielectric constant, low dissipation factor, high heat resistance, and high adhesiveness, enabling lamination at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional polyimide resin is used, then the resin film can be manufactured, but the dielectric constant is high which reduces signal transmission speed
Solution Approach 1:
The patent changes the chemical structure parameters of the diamine component by introducing fluorinated aromatic rings and specific aliphatic chain structures. This molecular-level parameter change reduces the dielectric constant of the polyimide resin, enabling faster signal transmission while maintaining the resin's fundamental properties for film manufacturing.
Solution Approach 2:
The patent creates a composite resin system by combining polyimide resin with specific additives including silane-modified polyethylene wax and metal oxide fillers. This composite approach reduces dielectric constant and improves signal transmission speed while maintaining manufacturability of the resin film.
2Reliability
If conventional polyimide resin is used, then the resin film can be manufactured, but the dissipation factor is high which increases signal transmission attenuation
Solution Approach 1:
The patent modifies the chemical parameters of the diamine component by incorporating fluorinated aromatic structures and specific aliphatic chains. These parameter changes reduce molecular polarity and dipole moments, thereby lowering the dissipation factor and reducing signal attenuation while maintaining resin film manufacturability.
Solution Approach 2:
The patent formulates a composite resin system combining polyimide with low-dissipation additives such as silane-modified polyethylene wax and specific metal oxide fillers. This composite structure reduces the overall dissipation factor, improving signal transmission integrity through the laminate.
3Ease of manufacture
If high lamination temperature is used, then the resin film can be manufactured with conventional polyimide, but manufacturing costs increase and energy consumption rises
Solution Approach 1:
The patent changes the thermal parameters of the polyimide resin by modifying the diamine structure to include flexible aliphatic chains and specific aromatic configurations. These parameter changes reduce the glass transition temperature and improve resin flow characteristics, enabling lamination at lower temperatures and reducing manufacturing costs and energy consumption.
4Manufacturing precision
If conventional polyimide resin is used, then the resin film can be manufactured, but the laminate exhibits dryness and numerous voids which reduce quality
Solution Approach 1:
The patent modifies the molecular parameters of the diamine component by introducing flexible aliphatic chains and specific aromatic structures that improve resin chain flexibility and packing. These parameter changes enhance resin flow and wetting characteristics during lamination, reducing void formation and improving laminate homogeneity and quality.
Solution Approach 2:
The patent creates a composite resin system incorporating polyimide with silane-modified polyethylene wax and metal oxide fillers that improve resin flow and wetting properties. This composite formulation enhances laminate quality by reducing dryness and voids while maintaining structural integrity.
Data Source
AI summary
A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.