Composite Circuit Substrate With Embedded Patterned Circuit
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Solution Overview
Problem
In semiconductor package technology, the distribution of glass fibers in dielectric layers can lead to short circuits due to electroplating solution permeation and electron mobility, causing conductive metal to form in gaps between glass fibers and the dielectric layer, which connects conductive wires and results in short circuits.
Innovation Solution
A composite circuit substrate structure is designed with a first dielectric layer having a patterned concave on its surface, where the patterned circuit is embedded, preventing contact with the glass fiber structure in the second dielectric layer, thereby reducing the likelihood of short circuits from permeation or electron mobility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass fiber structure is distributed in the dielectric layer to increase structural strength, then the structural strength of the dielectric layer is improved, but the patterned circuit may contact the glass fiber structure causing short circuit
Solution Approach 1:
The dielectric layer is segmented into two separate layers: a first dielectric layer containing the patterned circuit and a second dielectric layer containing the glass fiber structure. This segmentation physically separates the conductive elements from the reinforcing glass fibers, eliminating the short circuit risk while preserving the structural strength benefits of the glass fiber reinforcement in the second layer.
Solution Approach 2:
The first dielectric layer acts as an intermediary barrier between the patterned circuit and the glass fiber structure in the second dielectric layer. This intermediary layer prevents direct contact between conductive elements and glass fibers, thereby preventing short circuits while allowing the glass fiber-reinforced second layer to provide structural support.
2Productivity
If electroplating solution permeates into the gap between glass fiber structure and dielectric layer, then the electroplating process is completed, but conductive metal forms in the gap causing short circuit
Solution Approach 1:
By segmenting the dielectric layer into two separate layers with the patterned circuit embedded in the first layer and glass fibers in the second layer, the invention eliminates the gap between glass fibers and the circuit layer where electroplating solution could permeate and cause conductive metal formation. The electroplating solution can still access the patterned circuit through controlled pathways without reaching the glass fiber region.
Solution Approach 2:
The first dielectric layer serves as an intermediary barrier that prevents electroplating solution from reaching the glass fiber structure. This intermediary layer controls the permeation pathway, allowing electroplating to occur on the patterned circuit while blocking the solution from entering gaps where it could deposit conductive metal and cause short circuits.
3Productivity
If metal particles move to the gap between glass fiber structure and dielectric layer due to electron mobility, then the electroplating process occurs, but metal particles accumulate in the gap causing short circuit
Solution Approach 1:
The segmented dielectric structure separates the patterned circuit (first layer) from the glass fiber reinforcement (second layer), eliminating the gap where metal particles could accumulate during electroplating. This segmentation ensures that metal particles deposited during electroplating remain confined to the intended circuit areas and cannot migrate to cause short circuits between conductive wires.
Solution Approach 2:
The first dielectric layer acts as an intermediary barrier that prevents metal particles from reaching the glass fiber structure during electroplating. This intermediary layer blocks the migration pathway for metal particles, ensuring they accumulate only in controlled areas and cannot bridge gaps to create conductive paths between adjacent conductive wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuits by ensuring the patterned circuit does not contact the glass fiber structure, maintaining the structural integrity and reliability of the circuit substrate during electroplating and reliability tests.
Implementation Method 1
During an electroplating process, an electroplating solution possibly permeates into a gap between the glass fiber structure and the dielectric layer
Implementation Method 2
when a voltage is applied or moisture is increased in a reliability test, metal particles in the two conductive wires having a relatively small pitch therebetween move to the gap between the glass fiber structure and the dielectric layer due to electron mobility
Data Source
AI summary
A composite circuit substrate structure includes a first dielectric layer, a second dielectric layer, a glass fiber structure, and a patterned circuit. The first dielectric layer has a first surface and a second surface opposite to each other. The second dielectric layer is disposed on the first dielectric layer and entirely connected to the first surface. The glass fiber structure is distributed in the second dielectric layer. The patterned circuit is embedded in the first dielectric layer from the second surface, and the patterned circuit is not contacted with the glass fiber structure.