Multichip LED Package with Mirror Substrate for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional lighting devices such as incandescent and fluorescent bulbs suffer from quick attenuation, high power consumption, high heat generation, short working life, fragility, and non-recyclability, necessitating the development of more efficient and effective LED package structures.
Innovation Solution
A multichip package structure comprising a metal substrate with mirror plane areas, a circuit substrate with conductive pads, a light-emitting module with LED chips, a current-limiting module, and gel frames to enhance heat dissipation and light-emitting efficiency, where the LED chips are electrically connected in series and the modules are encased in gel bodies to optimize thermal management and light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional lighting devices (incandescent bulbs, fluorescent bulbs) are used, then lighting function is provided, but power consumption is high, heat generation is high, and working life is short
Solution Approach 1:
The patent transitions from traditional lighting technologies to LED technology, fundamentally changing the operating parameters and mechanism of light generation. LED chips convert electrical energy directly to light through electroluminescence, achieving significantly lower power consumption and higher reliability compared to incandescent or fluorescent bulbs
Solution Approach 2:
The patent replaces the mechanical/thermal lighting mechanisms of traditional bulbs with a semiconductor-based LED system. The LED chips use electroluminescence rather than thermal radiation or gas discharge, eliminating the need for filaments, gases, and complex starting mechanisms, thereby reducing power consumption and extending working life
2Temperature
If traditional lighting devices are used, then lighting function is provided, but heat generation is high
Solution Approach 1:
The patent converts the harmful heat that would normally be wasted into a beneficial feature by using reflective layers (aluminum or silver coating) to redirect and concentrate light output. The heat generated by LED chips is managed through thermal conduction to the metal substrate, while the reflective layers ensure that minimal light is lost to heat radiation
Solution Approach 2:
The patent changes the thermal management approach by using a metal substrate with high thermal conductivity to conduct heat away from LED chips. The reflective layers also play a role in thermal management by reflecting infrared radiation, thereby reducing heat accumulation and extending the working life of the LED module
3Reliability
If mirror plane areas are added to the metal substrate, then heat-dissipating efficiency and light-emitting effect are improved, but device complexity increases
Solution Approach 1:
The patent divides the metal substrate into distinct functional zones: a first mirror plane area for light reflection and emission, and a second mirror plane area for heat dissipation. This segmentation allows each area to be optimized for its specific function while maintaining a relatively simple overall structure
Solution Approach 2:
The patent applies different local qualities to different areas of the metal substrate. The first mirror plane area has high reflectivity for light, while the second mirror plane area has high thermal conductivity for heat dissipation. This local differentiation optimizes performance without requiring complete restructuring of the entire device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multichip package structure significantly improves heat-dissipating efficiency and light-emitting effect by utilizing a reflective metal substrate, efficient electrical connections, and gel encapsulation, thereby extending the lifespan and performance of LED-based lighting solutions.
Implementation Method 1
The metal substrate has a first mirror plane area and a second mirror plane area, wherein the first mirror plane area and the second mirror plane area are disposed on the top surface of the metal substrate
Implementation Method 2
The package unit includes a first package gel body and a second package gel body, wherein the first package gel body is received in the first gel position limiting space to enclose the light-emitting module
Data Source
AI summary
A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.