Flexible Circuit Board Multi-Layer Structure Signal Interference
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Solution Overview
Problem
Existing flexible circuit boards face challenges in managing high wiring density and interference between different signal types, particularly in display devices, where multiple signal types like display, touch, and fingerprint recognition signals need to be integrated, leading to increased complexity and mutual interference.
Innovation Solution
The design incorporates a multi-layer board structure with a thinned body area, where the first sub-body area has a multi-layer structure and the second sub-body area has a single or double-layer structure, with a thickness ratio between them optimized to reduce interference, and includes an electromagnetic shielding layer to prevent signal crosstalk, allowing for efficient distribution of wirings across different layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a multi-layer board structure is used in the first sub-body area, then signal transmission capability and wiring density are improved, but structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies different board structure configurations to different regions of the flexible circuit board. The first sub-body area uses a multi-layer board structure to achieve high wiring density and accommodate complex signal routing, while the second sub-body area uses a single-layer or double-layer structure to simplify the design and reduce complexity. This localized differentiation allows each region to be optimized for its specific functional requirements.
Solution Approach 2:
The body area is divided into two distinct sub-body areas with different structural configurations. The first sub-body area contains the multi-layer structure for high-density wiring, while the second sub-body area has a simpler structure. This segmentation allows independent optimization of each region and facilitates easier manufacturing by dividing the complex fabrication process into manageable sections.
2Length of moving object
If the thickness of the second sub-body area is reduced, then the flexible circuit board enables narrow bezel design and component integration, but structural strength and reliability may be compromised
Solution Approach 1:
The patent implements different thickness configurations in different regions. The second sub-body area has reduced thickness to enable narrow bezel design and allow components like batteries to extend below the circuit board, while the first sub-body area maintains greater thickness to provide structural support and reliability where needed. This local quality differentiation optimizes both form factor and structural integrity.
3Adaptability or versatility
If multiple signal types are integrated into the flexible circuit board, then functionality and wiring density are improved, but signal interference and mutual disruption increase
Solution Approach 1:
The patent segments the circuit board into different sub-body areas with distinct structural characteristics. The first sub-body area with its multi-layer structure provides dedicated pathways and isolation for different signal types, while the second sub-body area with its simpler structure reduces potential sources of interference. This spatial segmentation helps isolate different signal types and reduces mutual disruption.
Solution Approach 2:
The multi-layer board structure in the first sub-body area utilizes the vertical dimension to route different signals through separate layers, physically separating them and reducing electromagnetic interference. This three-dimensional wiring architecture allows multiple signal types to coexist without significant mutual disruption, enhancing the board's adaptability while controlling harmful signal interactions.
Data Source
AI summary
A flexible circuit board including: a body area including a plurality of wirings; a bonding area combined with a first side of the body area; and an extension area combined with a second side of the body area opposite to the first side. The body area includes a first sub-body area and a second sub-body area located on a side of the first sub-body area close to the extension area; the plurality of wirings at least include a first wiring, a second wiring and a third wiring all extend in the first sub-body area, and the first wiring and the second wiring extend in the second sub-body area. The first sub-body area includes a multi-layer board structure, the second sub-body area includes a single-layer board structure or a double-layer board structure, and a thickness of the second sub-body area is smaller than a thickness of the first sub-body area.