Multi-Pole Plug Connector Terminal Pin Length Variation

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Solution Overview

Problem

Existing multi-pole plug connectors and multi-layer circuit boards face challenges in efficiently contacting high-frequency digital signals without signal attenuation or eye pattern folding, particularly in applications like backplanes for high-speed internet signal transmissions.

Innovation Solution

The design features terminal pins of varying lengths for contact elements that align with blind holes terminating at different conductor levels on the multi-layer circuit board, allowing straight-line guidance of strip conductors without curvatures, and adjusting electrical properties to maintain low signal runtime differences and characteristic impedance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If terminal pins of uniform length are used in plug connectors, then manufacturing is simplified, but contacting conductor strips at different levels becomes impossible

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcontacting capability at different conductor levels
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by varying the length of terminal pins according to their specific contacting requirements. Each terminal pin is designed with a specific length adapted to the depth of the blind hole and the level of the conductor strip it must contact, allowing different parts of the same component to have different properties (lengths) to fulfill their specific functions.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements dynamics by making the terminal pin lengths adjustable or selectable based on the application requirements. The plug connector can be configured with different terminal pin length combinations to adapt to various multi-layer circuit board configurations, providing flexibility in contacting conductor strips at different levels.

Inventive Principle:
Principle #15Dynamics

2Reliability

If blind holes are drilled through all layers of multi-layer circuit board, then through-plating is achieved, but short-circuits between different conductor levels may occur

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidshort-circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies segmentation by dividing the blind holes into different depth segments that correspond to different conductor levels. Each blind hole is drilled only to the specific depth required to access the target conductor strip, rather than penetrating through all layers. This segmentation prevents the drill from creating through-holes that could cause short-circuits between unrelated conductor levels.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements preliminary action by pre-determining the exact depth of each blind hole based on the known structure and conductor level positions of the multi-layer circuit board. The blind holes are drilled to predetermined depths that stop precisely at the target conductor level, preventing unintended contact with deeper conductor strips and eliminating short-circuit risks.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If strip conductors are routed with curvatures to reach contact points, then flexibility in layout is improved, but signal transmission quality deteriorates at high frequencies

Engineering Contradiction:
Improvelayout flexibilityVSAvoidsignal transmission quality
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies dimensionality change by utilizing the vertical dimension (depth) to accommodate conductor strips at different levels. Instead of routing conductors with curvatures in the horizontal plane to reach contact points, the invention allows conductor strips to be positioned at different vertical levels (different layers of the multi-layer circuit board), enabling straight-line routing while maintaining layout flexibility through vertical stacking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Productivity

If contact elements are arranged in high-density configuration, then productivity and space utilization are improved, but maintaining characteristic impedance becomes more difficult

Engineering Contradiction:
Improvecontact densityVSAvoidcharacteristic impedance control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by adjusting the terminal pin lengths to compensate for the reduced spacing between contact elements in high-density configurations. By varying the length parameters of terminal pins, the electrical characteristics (such as characteristic impedance and signal runtime) can be optimized even when contact elements are densely packed, allowing high productivity without sacrificing impedance control.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8622751B2Plug connector and multi-layer circuit board
Publication Date: 2014.01.07 ERNI PRODUCTION GMBH & CO KG
  • US8622751B2 patent drawing
  • US8622751B2 patent drawing
  • US8622751B2 patent drawing

AI summary

The invention relates to a multi-pole plug connector (90) for contacting a multi-layer circuit board (51), comprising a plurality of contact elements (50a, 50b-50′a, 50′b), as well as to a multi-layer circuit board for assembly with a multi-pole plug connector (90), comprising blind boreholes (60a, 60b-60′a, 60′b) for contacting terminal pins (53a, 53b-53′a, 53′b) of the contact elements (50a, 50b-50′a, 50′b) of the multi-pole plug connector (90). The invention further relates to a combination of a multi-pole plug connector (90) for contacting with a multi-layer circuit board (51) and to a multilayer circuit board for assembly with the multi-pole plug connector (90). The plug connector (90) according to the invention is characterized by terminal pins (53a, 53b-53′a, 53′b) that have different lengths for contacting the terminal pins (53a, 53b-53′a, 53′b) with conductors (52a, 52b; 72a, 72b-72′a, 72′b) of the multi-layer circuit board (51) provided in different conductor levels (71-71′). The multi-layer circuit board (51) according to the invention is characterized by blind boreholes (60a, 60b-60′a, 60′b) that terminate in different conductor levels (71-71′) of the multilayer circuit board (51) for deliberately contacting the terminal pins (53a, 53b-53′a, 53′b) with conductors (52a, 52b; 72a, 72b-72′a, 72′b) of the multilayer circuit board (51) provided in different conductor levels (71-71′).