Circuit Board Laser Resistant Structures for Depth Control
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Solution Overview
Problem
Current circuit board manufacturing techniques face challenges in controlling the depth of laser machining, leading to potential over-trenching of dielectric layers, which affects the thickness and integrity of the board.
Innovation Solution
Incorporating a first and second laser resistant structure on the circuit board, with gaps between them, to control the depth of laser machining and protect the underlying dielectric layers, ensuring precise removal of layers without damaging the first dielectric layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If laser machining is used to remove dielectric layers, then the thickness of the circuit board can be reduced, but the depth of laser machining cannot be controlled precisely causing over-trenching
Solution Approach 1:
A laser-resistant structure is introduced as an intermediary element between the laser beam and the dielectric layers. This structure absorbs or blocks the laser energy, preventing the laser from penetrating through to the first dielectric layer. The laser-resistant structure acts as a mediator that controls the machining depth by stopping the laser beam at a predetermined location, thus solving the precision control problem while maintaining thickness reduction benefits.
Solution Approach 2:
The laser-resistant structure is pre-formed on the circuit board before the laser machining process. This preliminary structure is positioned at a specific depth and serves as a pre-planned stopper for the laser beam. By preparing this protective structure in advance, the system ensures that the laser machining will naturally stop at the correct depth without requiring complex real-time control mechanisms.
2Quantity of substance
If the third and fourth dielectric layers are removed through laser machining, then the removing area can be thinned, but the first dielectric layer may be over-trenched
Solution Approach 1:
The laser-resistant structure serves as a protective intermediary that prevents the laser beam from damaging the first dielectric layer. It is positioned between the laser source and the first dielectric layer, absorbing or blocking the laser energy before it can reach the underlying layers. This ensures that only the third and fourth dielectric layers are removed, while the first dielectric layer remains intact, thus maintaining reliability while achieving the desired material removal.
Solution Approach 2:
The laser-resistant structure is installed in advance as a protective cushion against the laser beam. It is positioned at a depth that provides a safety margin, ensuring that even if the laser machining process varies, the first dielectric layer is protected from damage. This beforehand protective measure prevents over-trenching and maintains the integrity of the underlying structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of laser machining depth, improving production yield and preventing damage to the first dielectric layer, thereby enhancing the manufacturing process and board quality.
Implementation Method 1
the portions of the third dielectric layer 140 and the fourth dielectric layer 150 located at the periphery of the pre-removing area L are removed through laser machining
Data Source
AI summary
A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.