Circuit Board Layer Structure for High-Frequency Signal Integrity
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Solution Overview
Problem
Conventional circuit boards face challenges in adapting to high-frequency and high-speed trends due to high dielectric constant, loss factor, moisture absorption, and poor reliability of polyimide substrates, leading to significant signal transmission loss and copper ion migration issues, which are not adequately addressed by traditional manufacturing processes.
Innovation Solution
A method for preparing a novel material layer structure for circuit boards using films like MPI, LCP, TFP, and PTFE, combined with copper layers and ion migration resistant adhesives, to create a structure that enhances high-frequency characteristics and prevents copper ion migration, simplifying manufacturing and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyimide (PI) substrate is used in conventional soft boards, then the substrate provides basic insulating properties and structural support, but the high-frequency transmission loss is serious due to larger dielectric constant and loss factor
Solution Approach 1:
The patent changes the material parameters by replacing conventional PI substrate with low-dielectric constant materials (such as PTFE, LCP, or other high-frequency specialized substrates) that have specifically optimized dielectric properties for high-frequency applications, thereby reducing transmission loss and improving signal integrity
Solution Approach 2:
The patent employs composite material structures combining low-dielectric constant substrate materials with copper foil and protective layers, creating a multi-layer composite structure that optimizes both electrical performance for high-frequency signals and mechanical properties for manufacturing
2Reliability
If conventional multi-layer structure with PI film and epoxy adhesive is used, then the circuit board has basic protective and isolating functions, but the manufacturing process is complex with more process flows
Solution Approach 1:
The patent extracts and eliminates unnecessary intermediate processing steps and redundant material layers from the conventional multi-layer manufacturing process, streamlining the production flow while maintaining the essential protective and isolating functions through optimized material selection and integrated layer design
Solution Approach 2:
The patent designs material layers that perform multiple functions simultaneously - for example, the low-dielectric substrate provides both mechanical support and optimized electrical transmission, while adhesive layers provide both bonding and electrical isolation, reducing the need for separate dedicated layers for each function
3Ease of manufacture
If conventional PI substrate is used, then the substrate provides basic insulating properties, but the moisture absorption is high and reliability is poor
Solution Approach 1:
The patent changes the chemical and physical parameters of the substrate material by selecting materials with inherently lower moisture absorption characteristics, such as PTFE or LCP substrates, which maintain excellent insulating properties while providing superior moisture resistance and long-term reliability in humid environments
4Productivity
If traditional manufacturing processes are used, then the circuit board can be produced, but copper ion migration occurs between lines causing circuit failure
Solution Approach 1:
The patent introduces specialized barrier layers and adhesive materials that act as intermediaries between copper conductors, preventing copper ion migration while maintaining electrical connectivity and mechanical bonding, thereby eliminating the reliability issue without sacrificing manufacturing productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel material layer structure improves signal transmission performance, reduces power consumption, and prevents copper ion migration, enabling circuit boards to meet the demands of high-frequency and high-speed applications, particularly for 5G technology products, while simplifying and accelerating the manufacturing process.
Implementation Method 1
applying a semi-cured functional material layer on the back of the film at a temperature of 60° C.-500° C.
Data Source
AI summary
The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.