Light Absorption Dielectrics TRIZ Cases
- PCB Laser Blocking Layer for Safe Battery Cell Welding
A reflective blocking layer under the PCB weld spot stops laser penetration, protecting internal circuits during battery cell assembly welding.
- UV-Curable Resin Composition for Deep and Shadowed Area Curing
A fluorescent UV-curable resin composition improves curing in deep and light-shielded areas without heat or moisture curing delays.
- Phosphor Substrate Layout for LED Color Tuning and Warpage Control
A phosphor layer and overlapping rear electrodes let LED substrates tune emitted color while improving heat dissipation and suppressing warpage.
- Phosphor Substrate Layout for LED Color Conversion and Glare Reduction
A flat electrode and surrounding phosphor layer shift LED emission color while reducing glare and chromaticity variation.
- Antireflective Metal Wiring for Transparent Conductive Substrates
Roughened silver or copper wiring with embedded fine blackened particles cuts glare while preserving conductivity in transparent substrates.
- Phosphor Substrate Structure for LED Color Conversion and Chromaticity Control
A phosphor layer arranged around flat LED electrodes enables wavelength conversion, color adjustment, lower glare, and reduced chromaticity variation.
- Phosphor Substrate Rear Electrode Structure for Warpage Suppression
Rear-surface electrodes balance heat stress in a phosphor substrate, suppress warpage, and keep phosphor-based LED color tuning stable.
- Optical Sensor Shielding Structure for EMI and Deformation Control
A grounded shielding member with reflective and absorptive particles cuts EMI and stray light around optical sensors while limiting deformation.
- Optical Sensor Module EMI Shield Grounding With Conductive Vias
Protruding grounding pads, conductive vias, and coatings connect an optical sensor module’s EMI shield to ground, limiting leakage and crosstalk.
- Optical Sensor Module EMI Shield Grounding for Low Leakage
Grounding pads, conductive vias, and coatings connect the external EMI shield to reduce leakage and crosstalk without expanding the module footprint.
- Recyclable Electronic Device With Delamination Layers for Component Recovery
Delamination layers separate encapsulated electronics from substrates for recycling while limited interconnections maintain structural integrity during use.
- Circuit Board Layer Structure for High-Frequency Signal Integrity
Replacing polyimide substrates with low-loss materials like PTFE and LCP reduces dielectric constant and signal transmission loss in high-speed circuit boards.