Optical Sensor Shielding Structure for EMI and Deformation Control
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Solution Overview
Problem
As electronic devices are miniaturized, the reduced spacing between components leads to electromagnetic interference causing performance degradation, necessitating a solution to shield electromagnetic waves effectively.
Innovation Solution
Incorporation of a shielding member with a first adhesive layer, a first shielding layer electrically connected to a ground pad, and a cover layer containing reflective and absorptive particles to manage electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are miniaturized to reduce size, then device dimensions are reduced, but electromagnetic interference between components increases causing performance degradation
Solution Approach 1:
A shielding member is introduced as an intermediary component between electronic components to block electromagnetic waves. The shielding member includes a shielding layer with conductive particles that reflect and absorb electromagnetic interference, preventing it from affecting other components while allowing the device to maintain its miniaturized form.
Solution Approach 2:
The shielding member utilizes composite materials consisting of a polymer matrix combined with conductive particles (such as metal particles or carbon-based materials). This composite structure provides both the mechanical properties needed for device integration and the electromagnetic shielding capabilities required to prevent interference in miniaturized devices.
2Object-affected harmful factors
If shielding members are added to block electromagnetic waves, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding member is designed to perform multiple functions simultaneously: it provides electromagnetic shielding, structural support, and adhesion between components. By integrating these functions into a single component, the overall device complexity is minimized while still achieving effective electromagnetic interference protection.
Solution Approach 2:
The shielding properties of the shielding member can be adjusted by changing parameters such as particle concentration, particle size, and material composition. This allows the shielding effectiveness to be optimized for different frequency ranges and interference levels without requiring fundamentally different structural designs, thereby managing complexity.
3Volume of moving object
If spacing between electronic components is reduced to enable miniaturization, then device volume decreases, but electromagnetic wave interference increases
Solution Approach 1:
The shielding member acts as an intermediary barrier placed between closely-spaced electronic components. Even with reduced spacing, the shielding layer with its conductive particles effectively blocks electromagnetic waves from propagating between components, allowing miniaturization to proceed without sacrificing performance.
Solution Approach 2:
The shielding member can be selectively applied in specific regions where electromagnetic interference is most critical. By concentrating shielding materials in key areas rather than uniformly throughout the device, the design achieves effective interference protection while maintaining compact dimensions and minimizing overall material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding member effectively reduces electromagnetic interference, maintaining component performance and preventing deformation in miniaturized electronic devices.
Implementation Method 1
a plurality of first particles configured to reflect or scatter light
Implementation Method 2
a plurality of first particles configured to reflect or scatter light
Implementation Method 3
a plurality of second particles configured to absorb the light reflected inside of the housing
Implementation Method 4
a first shielding layer electrically connected to the ground pad, and disposed on the first adhesive layer
Data Source
AI summary
An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.