Recyclable Electronic Device With Delamination Layers for Component Recovery
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Solution Overview
Problem
The recyclability of electronic devices is hindered by the high level of integration in printed electronics, making it difficult to dismantle and recycle components without damaging the device or wasting materials.
Innovation Solution
Incorporating delamination layers between the electronic components and the substrate or encapsulation layer allows for easy separation of components during recycling, while maintaining structural integrity during normal use through limited interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If delamination layers are added to facilitate component separation during recycling, then recyclability is improved, but device complexity increases
Solution Approach 1:
The patent divides the encapsulation structure into multiple functional layers: a first encapsulation layer directly bonding to the substrate, and a second encapsulation layer bonded to the first encapsulation layer. This segmentation allows the second layer to be removed during recycling while leaving the first layer intact, facilitating component separation without requiring complex multi-material structures.
Solution Approach 2:
The first encapsulation layer serves as an intermediary between the substrate and the second encapsulation layer. It provides a bonding interface that allows the second layer to be selectively removed while maintaining the structural integrity of the substrate and the first layer, enabling simplified recycling without increasing overall device complexity.
2Ease of operation
If delamination layers are removed during recycling, then component separation is improved, but structural integrity during normal use may be compromised
Solution Approach 1:
The patent creates a dynamic encapsulation structure where the bonding strength between layers is context-dependent. During normal operation, the first and second encapsulation layers maintain strong bonding to protect the electronic components. During recycling, the second layer can be selectively removed from the first layer without damaging the substrate or components, enabling easy component separation while maintaining structural integrity when needed.
Solution Approach 2:
By dividing the encapsulation into separate layers with different removal characteristics, the patent enables selective removal of the second encapsulation layer during recycling while the first layer remains bonded to the substrate. This segmentation allows component separation without compromising the structural strength provided by the first layer during normal use.
3Reliability
If complete encapsulation is provided for protection, then device reliability is improved, but recyclability deteriorates due to difficulty in separation
Solution Approach 1:
The patent segments the encapsulation into a first encapsulation layer that provides permanent protection bonded to the substrate, and a second encapsulation layer that provides additional protection but can be selectively removed during recycling. This segmentation maintains comprehensive device protection during use while enabling recyclability by allowing removal of the second layer to expose electronic components for recovery.
Solution Approach 2:
The patent enables a selective discarding and recovering process where the second encapsulation layer can be removed and discarded, while the first encapsulation layer remains bonded to the substrate for continued protection. This allows electronic components to be recovered and reused, improving overall device recyclability while maintaining reliability through the remaining first encapsulation layer.
Data Source
AI summary
An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.