UV-Curable Resin Composition for Deep and Shadowed Area Curing

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Solution Overview

Problem

Existing ultraviolet-curable resin compositions face challenges in achieving sufficient curing in light shielding portions and deep parts, where ultraviolet rays cannot reach effectively.

Innovation Solution

A novel ultraviolet-curable resin composition comprising at least one polymer from poly(meth)acrylates or polyvinyl ethers, a compound with secondary thiol groups, a specific photopolymerization initiator, and an organic compound that emits light upon absorbing ultraviolet rays, ensuring adequate curing in shadowed or deep areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional ultraviolet-curable resin compositions are used, then curing proceeds well in exposed areas, but curing is insufficient in light shielding portions and deep parts where ultraviolet rays cannot reach

Engineering Contradiction:
Improvecuring completenessVSAvoidinsufficient curing in shadow portions
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a light-emitting compound as an intermediary substance that absorbs ultraviolet light and re-emits it at a longer wavelength. This emitted light then penetrates the resin composition to enable curing in deep portions and shadow areas, effectively mediating between the UV light source and the polymerizable compounds in hard-to-reach areas.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the wavelength parameter of the curing light by using a light-emitting compound that converts UV light to visible light with a longer wavelength. This parameter change allows the light to penetrate deeper into the resin composition and reach areas that UV light alone cannot effectively cure.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If heat curing or moisture curing is combined with ultraviolet curing to cure light shielding portions, then curing completeness improves, but deformation and adhesion reduction occur due to heat, and moisture curing takes excessive time

Engineering Contradiction:
Improvecuring completeness in deep portionsVSAvoiddeformation and adhesion reduction
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces thermal curing and moisture curing mechanisms with a photonic mechanism. By using a light-emitting compound that emits visible light upon UV irradiation, the system achieves curing through light energy rather than heat or moisture, thereby avoiding the deformation and adhesion problems associated with thermal curing and the time delays of moisture curing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If a thick coating film or deep molded article is obtained, then the functional performance improves, but ultraviolet rays cannot sufficiently reach deep parts resulting in insufficient curing

Engineering Contradiction:
Improvecoating film thicknessVSAvoidcuring completeness in deep parts
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The light-emitting compound acts as a mediator that enables UV light to effectively cure thick coating films and deep molded articles. The compound absorbs UV light and re-emits it at a longer wavelength that has better penetration depth, allowing complete curing throughout the entire thickness of the coating or mold.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent introduces an additional optical dimension by using a light-emitting compound that converts UV wavelength to visible wavelength. This dimensional change in the electromagnetic spectrum allows the light to penetrate deeper into the material, enabling curing of thick sections that would be inaccessible to UV light alone.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition ensures complete curing in light shielding portions and deep parts, even when using UV-LED light sources, making it suitable for applications requiring strong adhesion and insulation, such as electronic circuit boards and optical lens units.

Implementation Method 1

on being irradiated with ultraviolet rays, photopolymerization initiators generate active radicals

Methodology Applied
Scientific EffectPhotolysis: Photodissociation

Implementation Method 2

an organic compound that emits light by absorbing prescribed ultraviolet rays

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Data Source

PatentUS20250026917A1Ultraviolet-curable resin composition, adhesive, sealant, insulating protective agent, and electronic circuit board
Publication Date: 2025.01.23 PELNOX
  • US20250026917A1 patent drawing
  • US20250026917A1 patent drawing
  • US20250026917A1 patent drawing

AI summary

One ultraviolet-curable resin composition of the present invention includes: (A) at least one polymer selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); (B) a compound having at least two secondary thiol groups in a molecule thereof; (C) a photopolymerization initiator a solution of which in acetonitrile with a concentration of 500 ppm has an absorbance of 0.50 or more in an optical path length of 10 mm at 385 nm; and (D) an organic compound that emits light upon absorbing ultraviolet rays, having a maximum wavelength of an absorption spectrum in a range of 300 nm or more and 450 nm or less, and having a maximum wavelength of an emission spectrum in a range of 350 nm or more and 500 nm or less; wherein a content of the compound (B) is 10 mass % or more and 70 mass % or less based on 100 mass % of the resin composition in terms of solid content.