Circuit Board Material Layer Structure for High-Frequency Applications
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Solution Overview
Problem
Conventional circuit boards, particularly those using polyimide substrates, face challenges in high-frequency and high-speed applications due to high dielectric constant, loss factor, moisture absorption, and copper ion migration issues, which hinder their ability to meet the requirements of 5G technology products.
Innovation Solution
A method for preparing a novel material layer structure for circuit boards using films such as MPI, LCP, TFP, or PTFE with copper ion migration resistant materials, applied as semi-cured functional layers, to form a novel material layer structure that enhances high-frequency characteristics and prevents copper ion migration, facilitating the manufacturing of single-layer, multi-layer flexible, and multi-layer soft-hard combined boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PI substrate is used in conventional soft boards, then the structure is simple and manufacturing is easy, but the dielectric constant and loss factor are high, moisture absorption is high, and copper ion migration occurs, leading to serious high-frequency transmission loss
Solution Approach 1:
The patent applies composite materials by combining film (MPI, LCP, TFP, or PTFE) with copper layer and semi-cured functional material layer to create a novel material layer structure. This composite structure replaces the conventional PI substrate, achieving low dielectric constant, low loss factor, low moisture absorption, and copper ion migration resistance, thereby resolving the high-frequency transmission loss issue while maintaining structural integrity
Solution Approach 2:
The patent changes the material parameters by selecting films with specific properties (low dielectric constant, low loss factor, low moisture absorption) and applying semi-cured functional material layer with copper ion migration resistance. This parameter optimization enables the circuit board to achieve excellent high-frequency transmission characteristics and prevent copper ion migration
2Reliability
If traditional multi-layer flexible circuit board or multi-layer combination of hard and soft boards is used, then the circuit board can achieve multi-layer structure, but the process flow is long, manufacturing process is complex, and power consumption and signal transmission loss are high
Solution Approach 1:
The patent merges the film, copper layer, and semi-cured functional material layer into an integrated novel material layer structure. This combined structure serves as a complete circuit board substrate that can directly form single-layer, multi-layer flexible, or multi-layer soft-hard combined boards, simplifying the manufacturing process and reducing power consumption and signal transmission loss
3Reliability
If conventional circuit board structure is used, then the manufacturing process is simple, but copper ion migration occurs between lines when powered on, causing circuit burn and explosion risks
Solution Approach 1:
The patent introduces semi-cured functional material layer as an intermediary between the copper layer and film. This intermediate layer provides copper ion migration resistance, preventing copper ions from migrating between circuit lines while maintaining the simplicity of the manufacturing process through direct hot-pressing lamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel material layer structure improves signal transmission speed and reduces power consumption, while preventing copper ion migration, ensuring safe and effective circuit operation, thus adapting to high-frequency and high-speed trends and supporting 5G technology products.
Implementation Method 1
applying a semi-cured functional material layer on the back of the film at a temperature of 60° C.-500° C.
Data Source
AI summary
The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.