Circuit Board Solder Resist Structure for Fine Pattern Support
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Solution Overview
Problem
Conventional circuit boards with fine circuit patterns face issues of collapse and abrasion due to the outermost patterns being unsupported, leading to reliability concerns, especially in high-frequency applications like 5G communication systems.
Innovation Solution
A circuit board structure is designed with a solder resist that includes varying heights and surface roughness to support the outermost circuit patterns, using a multilayer structure with a primer layer to enhance adhesion and prevent collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the outermost circuit pattern protrudes on the insulating layer to enable fine circuit patterns, then the circuit integration degree is improved, but the circuit pattern easily collapses
Solution Approach 1:
A support structure is introduced as an intermediary element between the circuit pattern and the insulating layer. This support structure provides mechanical reinforcement to the protruding outermost circuit pattern, preventing its collapse while allowing the fine circuit pattern to maintain its protruding configuration for high integration.
Solution Approach 2:
The circuit board employs a composite structure combining the insulating layer, circuit pattern, and support structure. This composite configuration leverages the electrical conductivity of the circuit pattern while utilizing the mechanical strength of the support structure to prevent collapse, achieving both fine patterning and structural stability.
2Manufacturing precision
If the circuit line width is reduced to several micrometers or less to increase circuit integration, then the degree of circuit integration is improved, but the circuit pattern becomes more susceptible to collapse and abrasion
Solution Approach 1:
The support structure is divided into multiple segments that correspond to different regions of the circuit pattern. This segmentation allows the support structure to provide localized reinforcement to the most vulnerable areas of the fine circuit patterns while maintaining overall structural integrity and enabling precise control over the thin circuit line widths.
Data Source
AI summary
A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.