Circuit Board Reinforcement Pattern for Crack Suppression
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Solution Overview
Problem
Existing interposer POP packaging technology faces limitations in heat dissipation due to restrictions on chip thickness, leading to cracks in the resin area of printed circuit boards during the panel level package (PLP) process, which causes application defects.
Innovation Solution
A circuit board design featuring a substrate with an insulating layer, a cavity, and reinforcement patterns embedded in the insulating layer around the cavity to prevent cracks and enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a smear removal process is performed after cavity processing, then the glass fibers are etched to remove smears, but cracks occur in the PPG resin area due to mechanical/physical loads during the packaging process
Solution Approach 1:
The reinforcement pattern is formed in advance during the circuit board fabrication process, before the cavity processing and packaging operations. This preliminary reinforcement structure prevents cracks from occurring during subsequent mechanical/physical loads in the packaging process, while still allowing the smear removal process to be performed afterward to achieve the desired cavity quality.
2Strength
If the reinforcement pattern is placed close to the cavity edge, then crack suppression is maximized, but the first wiring pattern may be interfered with or shorted
Solution Approach 1:
The reinforcement pattern is strategically positioned in the resin area adjacent to the cavity edge, providing localized crack suppression where it is most needed. The pattern is designed to be spaced apart from the cavity edge sufficiently to avoid interfering with the first wiring pattern, thus achieving both crack prevention and electrical isolation through optimized local placement.
3Area of stationary object
If the first wiring pattern is placed close to the cavity edge, then space utilization is maximized, but the risk of shorting with the reinforcement pattern increases
Solution Approach 1:
The reinforcement pattern is designed to extend in the thickness direction (vertically) rather than only in the planar direction. By utilizing the vertical dimension, the reinforcement pattern can provide structural support and electrical isolation without occupying additional planar space that would interfere with the wiring pattern placement, thus maintaining both space utilization and electrical isolation.
Data Source
AI summary
A circuit board including a substrate having a first surface and a second surface facing each other, including an insulating layer disposed between the first surface and the second surface, and having a cavity penetrating in a direction perpendicular to the first surface, a first wiring pattern embedded in the insulating layer on the first surface to enable signal transmission, and a first reinforcement pattern embedded in the insulating layer on the first surface, disposed around the cavity to be spaced apart from an edge of the cavity, and configured to be separated from the first wiring pattern.