Printed Circuits Stress/Warp Reduction TRIZ Cases
- Segmented Printed Circuit Board Warpage Control
A segmented printed circuit board uses separation spaces between unit areas to structurally reinforce the substrate.
- Resin Substrate Warpage Reduction via Local Quality
Varying conductor pattern density across substrate regions reduces thermal stress, ensuring reliable surface mounting on printed wiring boards.
- Circuit Board Reinforcement Pattern for Crack Suppression
Embedding a reinforcement pattern around the cavity suppresses resin cracks during packaging, improving yield.
- Wiring Substrate Staggered Via Conductors Thermal Stress
Staggered via conductors distribute thermal stress across insulating layers, preventing cracks while maintaining electrical connectivity.
- PCB Gap Supporter with Solderable Metal Film and Insulation Sheet
A gap supporter uses a soldered metal thin film to clamp an insulation sheet onto a printed circuit board.
- Wiring Substrate Penetrating Conductor Filler Control
A wiring substrate design limits penetrating conductor width and restricts filler particle size near the via to ensure clean interfaces.
- VSDM Substrate Warpage Control via Asymmetric Stackup
Asymmetric PCB stackup design incorporates voltage switchable dielectric materials to provide electrostatic discharge protection.
- Rigid-Flexible PCB for Power Module Adaptability
A rigid-flexible printed circuit board uses stiffening films to locally increase rigidity while allowing flexible regions to bend.
- Thermosetting Resin Composition for Low Dielectric Loss and Heat Resistance
A thermosetting resin composition combining bisphenol M-type epoxy, cyanate ester, and polyphenylene ether resins to achieve low dielectric loss.
- Removable Substrate for IC Package Warpage Control
A temporary rigid substrate reduces warpage during packaging, then removal enables direct heat sink contact to improve thermal conductivity.
- Particle Damper Chamber Segmentation for PCB Vibration
Segmenting the damper into multiple spherical chambers prevents tungsten ball clumping, eliminating response delay and ensuring immediate energy dissipation.
- Shared Mounting Holes for PCB Alignment Pins and Support
A mounting plane assembly uses shared holes to attach alignment pins and support elements directly through the printed circuit board.
- Circuit Board Extension Portion Width Variation
Varying the extension portion width in low-density regions prevents voids and warpage during lamination.