Rigid-Flexible PCB for Power Module Adaptability
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Solution Overview
Problem
Existing power modules for traction inverters have rigid structures that are inflexible and require expensive modifications to accommodate different applications, leading to increased production costs and reduced adaptability.
Innovation Solution
A rigid-flexible printed circuit board (PCB) power module design that incorporates a rigid portion with conductive paths and flexible PCBs that can be bent up to 360 degrees without damage, allowing for greater application flexibility without modifying the manufacturing line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a rigid structure is used for power modules, then mass production is enabled, but adaptability to different applications is reduced
Solution Approach 1:
The PCB is segmented into rigid portions and flexible portions, allowing the rigid parts to maintain structural integrity for mass production while the flexible parts can be adapted to different application requirements without modifying the entire structure or manufacturing line
Solution Approach 2:
The PCB transitions from a completely rigid structure to a dynamic structure with flexible regions that can bend and adapt, enabling the same base design to serve multiple applications while maintaining production efficiency
2Adaptability or versatility
If the leadframe is modified to accommodate different control pin positions, then application flexibility is improved, but manufacturing cost increases
Solution Approach 1:
The flexible PCB is designed in advance with multiple possible bending configurations, allowing control pins to be positioned differently for various applications without requiring preliminary modifications to the leadframe or molding tool
Solution Approach 2:
The PCB's physical state is changed from rigid to flexible, fundamentally altering its properties to enable position adjustment without structural modification, thereby avoiding expensive manufacturing line changes
Data Source
AI summary
A power module including a rigid-flexible PCB that exits from a resin molding case, and includes a first PCB region having a stacked structure of piled up layers; a second PCB region having said stacked structure, further locally delimited at a first side by a top stiffening element and at a second opposite side by a bottom stiffening element; and a third PCB region having said stacked structure without the top and bottom stiffening elements. The top and bottom stiffening elements extend at a lateral surface of the molding case, where the PCB exits from the molding case, and are configured to locally increase the rigidity of the PCB with respect to regions of the PCB 20 where said top and bottom stiffening elements are absent. A power module and method of manufacturing the power module is also provided.


