Particle Damper Chamber Segmentation for PCB Vibration

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Solution Overview

Problem

Existing vibration dampening systems for printed circuit boards, such as particle impact dampers with tungsten balls, experience delays and inefficiencies due to the clumping of tungsten balls, which restricts instantaneous response and energy dissipation during vibrations.

Innovation Solution

The system incorporates spherically shaped storage chambers with particles that allow for unrestricted movement and adjustable chamber sizes, enabling quicker response times and reduced travel distances for particles to collide with chamber walls, thereby enhancing the instantaneous dampening of vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If tungsten balls are housed in a single cylindrical chamber, then the structure is simple and compact, but the balls clump together and experience delayed response during vibration events

Engineering Contradiction:
Improvechamber structureVSAvoidresponse delay
Core Design Contradiction:
Device complexityVSLoss of time

Solution Approach 1:

The single cylindrical chamber is divided into multiple separate chambers (first chamber and second chamber), each containing tungsten balls. This segmentation prevents the balls from clumping together in a single large space, allowing them to move more freely and respond instantaneously to vibration events without the delay caused by clumping in a unified chamber.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If tungsten balls are placed in a large chamber, then the travel distance is long and energy dissipation is greater, but the response time increases due to the distance particles must travel

Engineering Contradiction:
Improveenergy dissipationVSAvoidresponse time
Core Design Contradiction:
Loss of energyVSLoss of time

Solution Approach 1:

By dividing the damping system into multiple smaller chambers rather than one large chamber, the patent achieves both goals: the chambers are small enough for balls to travel quickly (reducing response time) while the multiple chambers collectively provide sufficient volume for adequate energy dissipation through repeated collisions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of increasing chamber volume in a single dimension (which would increase travel distance), the patent adds chambers in a different dimension (multiple parallel chambers), allowing the system to achieve greater total energy dissipation capacity without increasing the travel distance within each individual chamber.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If the chamber is positioned at the center of the PCB, then the structure is simple and symmetric, but it may not optimally dampen vibrations at the location experiencing strongest vibration

Engineering Contradiction:
Improvepositioning symmetryVSAvoidvibration dampening effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies local quality by positioning the particle impact damper specifically at locations on the PCB where vibration is strongest, rather than using a symmetric central position. This allows the damping effect to be concentrated where it is most needed, improving overall reliability by addressing the critical vibration hotspots.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in a faster vibration response and more efficient energy dissipation, extending the life of printed circuit board assemblies by reducing the risk of mechanical and electrical failures under excessive vibration conditions.

Implementation Method 1

This process dissipates energy from the vibrating printed circuit board through nonlinear loss mechanisms, including friction and the exchange of momentum

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

the exchange of momentum along with the transfer of kinetic energy to heat

Methodology Applied
Scientific EffectMomentum exchange: Conservation of Momentum

Implementation Method 3

the transfer of kinetic energy to heat

Methodology Applied
Scientific EffectKinetic energy transfer: Joule Heating

Data Source

PatentUS10021779B1Quick response particle damper for printed circuit boards and planar surfaces
Publication Date: 2018.07.10 TOPLINE CORP
  • US10021779B1 patent drawing
  • US10021779B1 patent drawing
  • US10021779B1 patent drawing

AI summary

An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired. The PID housing can be any shape such as a cube, a rectangular cuboid, a cylinder, sphere, triangular tetrahedron, triangular prism, polygon, toroid or any combination of shapes.