Circuit Board Rear-Surface Resistive Pads for Higher Integration Density
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Solution Overview
Problem
The increasing number of electronic elements on display device circuit boards necessitates improved integration density without expanding the board's area.
Innovation Solution
A circuit board design incorporating resistive pads with zero ohm resistance and conductive patterns on a second surface, allowing for electrical connections between pads without increasing the board's area, and including insulating layers with opening portions for pad placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the area of the circuit board is increased to mount more electronic elements, then the number of electronic elements that can be mounted increases, but the overall device size increases
Solution Approach 1:
The patent utilizes the thickness dimension of the circuit board by placing resistive pads on both the front surface and rear surface. This allows electronic elements to be mounted on the front surface while resistive pads are positioned on the rear surface, enabling electrical connections without requiring additional lateral space. The board's three-dimensional structure is exploited to accommodate both functional elements and test components within the same footprint.
Solution Approach 2:
The resistive pads are integrated into the existing circuit board structure by embedding them within conductive layers and insulating layers. The pads are positioned within the board's internal architecture rather than adding external protrusions, effectively nesting the test components within the board's own structure to avoid increasing the overall device envelope.
2Difficulty of detecting and measuring
If traditional resistive pads are used on the same surface as electronic elements, then circuit analysis and inspection are facilitated, but available mounting area for electronic elements is reduced
Solution Approach 1:
The circuit board is divided into functionally distinct surfaces: the front surface is dedicated to mounting electronic elements, while the rear surface is dedicated to providing resistive pads for circuit analysis and inspection. This spatial segmentation allows each surface to be optimized for its specific function without interfering with the other, maximizing the utilization of available area on each surface.
Solution Approach 2:
Resistive pads are positioned on the rear surface of the circuit board, utilizing the z-dimension (thickness direction) to separate test components from functional components. This vertical separation allows both electronic elements and resistive pads to coexist without lateral space conflicts, while still enabling effective circuit analysis through the pads on the rear surface.
3Adaptability or versatility
If zero-ohm resistors are added as separate components to achieve resistive pad functionality, then circuit option setting and analysis are enabled, but device complexity and manufacturing steps increase
Solution Approach 1:
The resistive pad functionality is merged directly into the circuit board's conductive layers, eliminating the need for separate zero-ohm resistor components. The pads are formed as integral parts of the board structure through standard PCB fabrication processes, combining the functions of structural support, electrical connection, and circuit configuration into a single integrated component.
Solution Approach 2:
The circuit board structure itself provides the resistive pad functionality through its conductive layers and insulating layers, without requiring external or additional components. The board's own structure is designed to create the necessary electrical connections and test points, making the system self-sufficient and reducing overall device complexity.
Data Source
AI summary
A circuit board includes a board including a first surface and a second surface opposing the first surface, where the board includes at least one conductive layer and at least insulating layer, a plurality of electronic elements disposed on the first surface of the board, and a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements. The resistive pads have a resistance of zero ohm.