A pre-formed trench guides separate cuts through hard resin and insulating layers, reducing delamination and damage in wiring structures.
A heating device lifts substrates into dispensing position while adjustable rails handle varying widths and shield transport parts from heat.
A staged process cures conductive fluid at electrode sites, then semi-cures resin at component-body sites to balance adhesion and electrical reliability.
A UV LED curing light pairs a copper heat sink with an electrically insulated NTC thermistor to limit overheating during extended use.
High-CTE potting can stress circuit boards, while low-CTE compounds hinder filling; fiber reinforcement and low-viscosity resin address both.
Controlled resin flow embeds a component in a carrier cavity, improving planarity, attachment reliability, and electrical robustness.
Dual bonding regions connect the touch sensor and flexible circuit while preserving drive-chip placement and back-side space.
A split spiral coil across spaced circuit boards uses magnetic-body filling and molding compound to save board space and increase inductance.
Inkjet-applied functional lacquer combines PCB coating and color-shade labeling, avoiding separate equipment and drying ovens.
Loose-tolerance socket insertion and six-axis optical feedback enable precise, reworkable PIC coupling without high insertion forces.
Grounded flexible circuit films and a metal support stabilize low potential voltage, limiting touch noise and luminance variation in flexible OLED panels.