Reworkable Optical Package Socket for Zero-Force PIC Alignment
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Solution Overview
Problem
Conventional methods for optically coupling photonic integrated circuits (PICs) with optical fibers are challenging for high-volume manufacturing due to tight positional tolerances and high insertion forces, leading to low throughput.
Innovation Solution
The use of liquid metal electrical contacts and a six-axis positioning mechanism for zero-insertion force alignment, combined with active feedback from the PIC's optical signal, allows for automatic alignment and attachment of the PIC to a package socket, enabling scalable high-volume manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment and gluing methods are used to optically couple PIC and fiber, then optical coupling is achieved, but manufacturing throughput is low due to tight positional tolerances and high insertion forces
Solution Approach 1:
The system divides the coupling process into two independent stages: first, mechanical insertion of the PIC into the socket with loose tolerances; second, optical alignment using the six-axis positioning mechanism. This segmentation allows each stage to be optimized independently, achieving both ease of manufacture and high precision.
Solution Approach 2:
The PIC is pre-positioned in the package socket using a simplified mechanical insertion process before optical alignment is performed. This preliminary mechanical positioning eliminates the need for precise alignment during the insertion process itself, thereby increasing manufacturing throughput while maintaining final optical coupling precision.
2Reliability
If conventional gluing methods are used to attach optical fiber to PIC, then optical coupling is achieved, but the process becomes challenging for high volume manufacturing
Solution Approach 1:
The patent extracts the optical alignment function from the mechanical insertion process. The six-axis positioning mechanism provides independent optical alignment capability, separating it from the simple mechanical socket insertion. This extraction eliminates the need for complex gluing processes while maintaining reliable optical coupling.
Solution Approach 2:
The system uses active feedback from the PIC's optical signal to drive the six-axis positioning mechanism during alignment. This feedback-based alignment process automatically optimizes the optical coupling without requiring manual intervention or complex adhesive application procedures, thereby improving both reliability and ease of manufacture.
3Manufacturing precision
If tight positional tolerances are enforced for PIC-fiber alignment, then optical coupling precision is improved, but insertion force increases making high volume manufacturing difficult
Solution Approach 1:
The system transitions from a static, single-step alignment process to a dynamic, two-stage process. First, the PIC is inserted with loose mechanical tolerances using minimal force. Then, the six-axis positioning mechanism dynamically adjusts the PIC position based on real-time optical feedback, achieving high precision without requiring high insertion forces.
Solution Approach 2:
The six-axis positioning mechanism acts as an intermediary between the simple mechanical socket and the final optical coupling. It provides the additional degrees of freedom needed to achieve precise alignment after the initial low-force mechanical insertion, thereby decoupling the relationship between insertion force and alignment precision.
Data Source
AI summary
An electronic device comprises an electro-optical circuit package including at least photonic integrated circuit (PIC) having at least one light source and a package substrate; a printed circuit (PCB) including at least one optical connector to receive light from the at least one light source; and multiple liquid metal electrical contacts disposed between the package substrate and the PCB.