Metal-Wiring Circuit Formation with Segmented Bonding Zones
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Solution Overview
Problem
Existing methods face challenges in appropriately electrically connecting metal wirings and electronic components, particularly due to issues with adhesion and stress generation at the bonding interface.
Innovation Solution
A method involving the application of a conductive fluid followed by curing, application of a semi-curable resin, mounting the component with the fluid and resin in specific states, and subsequent curing steps to ensure stable electrical connections and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a curable viscous fluid is coated and cured to form protrusions, then adhesion between component and substrate is improved, but the electrical connection reliability between metal wiring and electronic component deteriorates
Solution Approach 1:
The patent segments the bonding interface into two distinct functional zones: a first bonding area with direct metal wiring contact for electrical connection, and a second bonding area with resin paste for mechanical adhesion. This segmentation allows each zone to be optimized independently - the first area ensures reliable electrical contact while the second area provides strong mechanical bonding, resolving the contradiction between adhesion strength and electrical connection reliability.
Solution Approach 2:
The patent applies different material properties to different locations of the bonding interface. The first bonding area uses conductive material with high electrical conductivity for electrical connection, while the second bonding area uses resin paste with adhesive properties for mechanical bonding. This local differentiation of material quality ensures that each region performs its specific function optimally, preventing the trade-off between adhesion and electrical reliability.
2Reliability
If nanometer-sized metal fine particles are used in metal-containing liquid, then wiring conductivity is improved, but the bonding strength with electronic component deteriorates
Solution Approach 1:
The patent divides the bonding interface into two areas with different material compositions. The first bonding area uses metal-containing liquid with nanometer-sized particles for optimal electrical conductivity, while the second bonding area uses resin paste with micrometer-sized particles for optimal bonding strength. This spatial segmentation allows each material to be optimized for its specific function without compromise.
Solution Approach 2:
The patent employs composite material strategy by using different particle size distributions in different bonding areas. The first bonding area utilizes nanometer-sized metal particles embedded in conductive material for electrical pathways, while the second bonding area uses micrometer-sized particles in resin paste for mechanical interlocking and adhesion. This composite approach with spatially varying material properties resolves the contradiction between conductivity and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures secure electrical connections by maintaining an appropriate film thickness and contact area, reducing stress, and preventing positional deviation of components, thereby forming reliable circuits.
Implementation Method 1
a first curing step of curing the conductive fluid applied in the first application step
Implementation Method 2
a second curing step of semi-curing the curable resin applied in the second application step
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An electrical circuit forming method includes a wiring forming step of forming a metal wiring on a resin layer, a first application step of applying a conductive fluid to a planned mounting position of an electrode of an electronic component on the metal wiring, a first curing step of curing the conductive fluid applied in the first application step, a second application step of applying a curable resin to a planned mounting position of a component main body of the electronic component, a second curing step of semi-curing the curable resin applied in the second application step, a mounting step of mounting the electronic component such that the electrode comes into contact with the conductive fluid cured in the first curing step and the component main body comes into contact with the curable resin semi-cured in the second curing step, and a third curing step of curing the curable resin semi-cured in the second curing step, after the electronic component is mounted in the mounting step.