Curved Display Module With Dual-Region Touch Bonding
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Solution Overview
Problem
Existing display modules with curved surfaces face challenges in layout space for flexible circuit boards due to the need to avoid covering the drive chip and maintain uniform wire lengths, leading to potential electrical and brightness non-uniformity.
Innovation Solution
The display module design includes a first flexible circuit board connected to a touch sensor through dual bonding regions on opposite sides, allowing for efficient use of space on the back of the module and maintaining the position of the drive chip, thus avoiding electrical and brightness non-uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit board is positioned to avoid covering the drive chip, then the drive chip position is preserved, but the layout space for the flexible circuit board is reduced
Solution Approach 1:
The patent transitions from a single-side bonding layout to a dual-side bonding layout. The first bonding region is positioned on the first side of the display substrate away from the drive chip, while the second bonding region is positioned on the second side of the display substrate. This spatial distribution across multiple dimensions resolves the conflict between preserving drive chip position and providing sufficient layout space for the flexible circuit board.
2Manufacturing precision
If wire lengths are maintained uniform, then electrical uniformity is achieved, but the layout flexibility is reduced
Solution Approach 1:
The patent divides the bonding connection into two separate bonding regions positioned on opposite sides of the display substrate. This segmentation allows the flexible circuit board to be connected at multiple points, enabling uniform wire lengths to be achieved while maintaining layout flexibility. The first bonding region and second bonding region work together to distribute the electrical connections uniformly.
Solution Approach 2:
By positioning bonding regions on both the first side and second side of the display substrate, the patent creates a three-dimensional bonding arrangement. This dimensional expansion provides additional freedom in routing wires while maintaining uniform lengths, thus preserving layout flexibility alongside manufacturing precision.
Data Source
Figure 1~2A
Figure 2B~2D
Figure 3A
AI summary
A display module (100, 200) and a display device are disclosed. The display module (100, 200) includes a first flexible circuit board (130, 230), a display substrate (110, 210), and a touch sensor (120, 220) disposed on the display side of the display substrate (110, 210). The display substrate (110, 210) includes a flat region (111, 211) and curved surface regions (112, 214) on two sides of the flat region (111, 213) in a first direction (D1); the touch sensor (120, 220) includes a first bonding region (121, 221) and a second bonding region (122, 222) on a first side of a second direction (D2) intersecting with the first direction (D1); the first bonding region (121, 221) and the second bonding region (122, 222) are on a surface, away from the display substrate (110, 210), of the touch sensor (120, 220), stacked with the flat region (111, 213) and spaced apart from each other; the first flexible circuit board (130, 230) is electrically connected with the touch sensor (120, 220) through the first bonding region (121, 221) and the second bonding region (122, 222); the first flexible circuit board (130, 230) includes a main body (131, 231) and a first bonding connection portion (132, 232) and a second bonding connection portion (132, 232) which protrude from the main body (131, 231) and are spaced apart from each other; and the first bonding connection portion (132, 232) is bonded with the first bonding region (121, 221) so as to be electrically connected with the first bonding region (121, 221), and the second bonding connection portion (133, 233) is bonded with the second bonding region (122, 222) so as to be electrically connected with the second bonding region (122, 222). The display module (100, 200) can utilize the space on the back of the display module (100, 200) more effectively and realize the bonding of the touch sensor (120, 220) and the first flexible circuit board (130, 230).