Stacked Circuit Board Coil Structure for Compact Inductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing circuit board designs that incorporate a single conductive coil occupy significant space, hindering miniaturization and efficient space utilization.
Innovation Solution
The circuit board structure involves forming coil patterns on multiple circuit boards, with a conductive coil surrounding magnetic bodies, and filling gaps with a molding compound, allowing for reduced space occupation and enhanced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire conductive coil is formed in a single circuit board, then the inductor function is achieved, but the space occupation is significant
Solution Approach 1:
The conductive coil is divided into multiple segments (first coil pattern, second coil pattern, third coil pattern) disposed on different circuit boards (first circuit board, second circuit board, third circuit board). Each segment contributes to the overall inductor function while reducing the space occupation on any single board. The coil segments are electrically connected through conductive vias to form a complete spiral coil structure.
Solution Approach 2:
The inductor structure transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Multiple circuit boards are arranged vertically with coil patterns on each board, and magnetic bodies are positioned in cavities between or among the boards. This vertical stacking approach significantly reduces the horizontal footprint while maintaining or enhancing the inductance value.
2Reliability
If more coil turns are added to increase inductance, then the inductance value increases, but the space occupation increases
Solution Approach 1:
Instead of increasing coil turns in a planar fashion which consumes more board area, the patent utilizes the vertical dimension by stacking multiple circuit boards with coil patterns on each. The magnetic bodies are positioned in the vertical space between boards, creating a compact three-dimensional inductor structure that achieves high inductance with minimal footprint.
Solution Approach 2:
The structure employs nesting by placing magnetic bodies within cavities formed in the circuit boards, and positioning coil patterns around these magnetic bodies. The second circuit board is nested between the first and third circuit boards, with magnetic bodies fitting into cavities, creating a compact nested arrangement that maximizes inductance within minimal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves space utilization and facilitates miniaturization of circuit boards while enhancing inductance through increased magnetic body filling volume and coil turns.
Implementation Method 1
an inductor, a passive component in electronics, has multiple functions of, for example, filtering noise, suppressing momentary current, preventing interference caused by electromagnetic wave, shielding electromagnetic radiation, reducing electromagnetic interference and converting power
Data Source
AI summary
A circuit board structure and a manufacturing method thereof. Circuit board structure includes first circuit board, second circuit board, conductive coil, magnetic body and molding compound. First circuit board has first side surface and first cavity located on first side surface. Second circuit board has second side surface facing first side surface and being spaced apart from first side surface. Conductive coil is in a spiral shape and includes first coil pattern and second coil pattern. First coil pattern is disposed in first circuit board. Second coil pattern is disposed in second circuit board. First coil pattern is electrically connected to second coil pattern. Magnetic body is filled in first cavity of first circuit board. Conductive coil surrounds at least a part of magnetic body. Molding compound is filled in a gap between first side surface and second side surface.