Electronic Component Wiring Structures With Trench-Guided Cutting
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Solution Overview
Problem
Existing methods for manufacturing electronic component devices with insulating resin layers and wiring layers face challenges due to differing physical properties, particularly when the base material contains a hard resin portion with inorganic filler, leading to potential delamination or damage during cutting.
Innovation Solution
A method involving an intermediate structure with a base material and wiring layer, where the resin portion containing inorganic filler is cut separately from the insulating resin layer, using different cutting conditions tailored to the resin portion's hardness, thereby avoiding damage to the insulating resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same cutting method is used for both the resin portion and the insulating resin layer, then the cutting process is simple, but the insulating resin layer is damaged or delaminated
Solution Approach 1:
The patent divides the cutting process into two separate stages: first cutting the resin portion to create a groove, then cutting the insulating resin layer along the groove. This segmentation allows each material to be cut with appropriate conditions, preventing damage to the insulating resin layer while maintaining manufacturing efficiency.
Solution Approach 2:
The resin portion is cut first to form a groove before cutting the insulating resin layer. This preliminary action creates a pre-formed path that guides the subsequent cutting process, reducing the risk of delamination and damage to the insulating resin layer.
2Manufacturing precision
If a cutting method suitable for the hard resin portion is used, then the resin portion is cut effectively, but the insulating resin layer suffers delamination or damage
Solution Approach 1:
The patent applies segmentation by separating the cutting operations into distinct steps: first cutting the hard resin portion with appropriate conditions, then cutting the insulating resin layer with different conditions. This resolves the contradiction by allowing each material to be processed with its optimal cutting parameters.
Solution Approach 2:
The patent implements local quality by applying different cutting conditions to different parts of the workpiece. The resin portion is cut with conditions optimized for hard materials, while the insulating resin layer is cut with conditions optimized for softer, more delicate materials, preventing damage while maintaining cutting quality.
3Reliability
If the insulating resin layer and wiring are separated during cutting, then the wiring structure integrity is maintained, but the cutting process becomes more complex
Solution Approach 1:
The patent uses preliminary action by first forming a groove in the resin portion before cutting the insulating resin layer. This pre-formed groove acts as a guide that maintains wiring structure integrity during the subsequent cutting process, while not significantly increasing overall process complexity.
Solution Approach 2:
The groove formed in the resin portion serves as an intermediary structure that facilitates the separation of the insulating resin layer and wiring. This intermediate feature enables clean separation while maintaining wiring integrity, balancing manufacturing simplicity with structural reliability.
Data Source
AI summary
A method for manufacturing an electronic device, which includes, preparing an intermediate structure including a base material and a wiring layer, the base material having a first main surface and a second main surface on a rear side of the first main surface, the wiring layer being provided on the first main surface and having an insulating resin layer and wiring, the base material having a resin portion including a through portion penetrating from the first main surface to the second main surface, the wiring layer forming a trench having a bottom surface on which the through portion is exposed; and cutting the through portion along the trench, thereby forming a plurality of wiring structures, each having the divided base material.